Plating method and apparatus, and manufacturing method of thin film magnetic head using the same

Abstract

The invention relates to a frame plating method for forming a plating film using a mold formed by patterning a resist, and has an object to provide the frame plating method in which tilting of a resist frame having a high aspect ratio is easily and certainly prevented and a desired plating film can be formed. The constitution includes a developing/washing portion 100 for developing an exposed resist layer formed on a substrate 138 and for washing a developing solution by a washing solution, and a plating portion 50 for immersing a surface of the substrate 138 in a state where the washing solution is not dried after washing but is held, into a plating solution 62 to carry out plating.

What is claimed is:  
     
         1 . A plating method, comprising the steps of: 
 forming an electrode film on a substrate;    forming a resist layer on the electrode film;    developing the resist layer after exposure through a predetermined mask;    washing a developing solution on a surface of a resist frame formed through development by a washing solution; and    after washing, immersing a surface of the substrate in a state where the washing solution is held without being dried, into a plating solution to carry out plating.    
     
     
         2 . A plating apparatus, comprising: 
 a developing/washing port ion for developing an exposed resist layer formed on a substrate and for washing a developing solution by a washing solution; and    a plating portion for carrying out plating after washing by immersing a surface of the substrate in a state where the washing solution is held without being dried, into a plating solution.    
     
     
         3 . A plating apparatus according to    claim 2   , wherein the plating portion includes an opening portion to be closed by the substrate.  
     
     
         4 . A plating apparatus according to    claim 3   , wherein the developing/washing portion includes a transporting mechanism for transporting the substrate to the opening portion.  
     
     
         5 . A plating apparatus according to    claim 2   , further comprising a drainage receiving portion for receiving plating drainage between the developing/washing portion and the plating portion.  
     
     
         6 . A manufacturing method of a thin film magnetic head, comprising a plating process of forming a plating film using a mold formed by patterning a resist, wherein 
 the plating process comprises a plating method according to    claim 1   .