Apparatus and method for electroplating

Abstract

An apparatus and a method for electroplating for forming a metal film by an electroplating method. The apparatus comprises a plating bath provided in a non-oxidative atmosphere, and in the method, an article to be plated is immersed in a plating bath through a non-oxidative atmosphere.

What is claimed is:  
     
         1 . An apparatus for electroplating for forming a metal film by an electroplating method, said apparatus comprising a plating bath provided in a non-oxidative atmosphere.  
     
     
         2 . An apparatus for electroplating as claimed in    claim 1   , wherein 
 said non-oxidative atmosphere, in which said plating bath is provided, is provided in a plating chamber, and    said apparatus further comprises    a pre-treating chamber, in which a pre-treatment of an article to be plated is conducted, and    a transportation chamber connected to said pre-treating chamber and said plating chamber.    
     
     
         3 . An apparatus for electroplating as claimed in    claim 1   , wherein 
 said non-oxidative atmosphere is selected from a rare gas atmosphere, a nitrogen gas atmosphere and a hydrogen gas atmosphere.    
     
     
         4 . An apparatus for electroplating as claimed in    claim 2   , wherein 
 said non-oxidative atmosphere is selected from a rare gas atmosphere, a nitrogen gas atmosphere and a hydrogen gas atmosphere.    
     
     
         5 . A method for electroplating for forming a metal film by an electroplating method, an article to be plated being immersed in a plating bath through a non-oxidative atmosphere.  
     
     
         6 . A method for electroplating as claimed in    claim 5   , wherein 
 said non-oxidative atmosphere is selected from a rare gas atmosphere, a nitrogen gas atmosphere and a hydrogen gas atmosphere.