Method of manufacturing semiconductor device and tray used in the method

Abstract

A tray is constituted by a tray body portion for connecting a plurality of pockets and cushioning portions which are arranged on the bottom portions of the pockets serving as contact positions between the pockets and CSPs when the CSPs are stored in the pockets and which are formed of a soft material having a degree of hardness lower than that of the tray body portion. The tray moderates impact force acting on the CSPs in falling the tray to prevent the CSP from being broken and damaged.

What is claimed is:  
     
         1 . A method of manufacturing a semiconductor device with storing semiconductor devices in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform desired processes such as preservation, transportation, and inspection for the semiconductor devices, comprising: 
 the step of preparing a plurality of trays each having a tray body portion for connecting a plurality of storage portions; and cushioning portions arranged at contact positions between the storage portions and the semiconductor devices and formed of a material softer than the tray body portion;    the step of arranging the semiconductor devices in the storage portions of the trays to support the semiconductor devices with the cushioning portions; and    the step of building up the tray and another tray which can be built up on the tray and arranging the cushioning portions of the tray and the other tray on both of front and rear surface sides of the semiconductor devices in the storage portions of the tray to store the semiconductor devices.    
     
     
         2 . A method of manufacturing a semiconductor device with storing semiconductor devices in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising: 
 the step of preparing the plurality of trays each having a tray body portion for connecting the plurality of storage portions; and cushioning portions arranged on bottom portions which are contact positions between the storage portions and the semiconductor devices and formed of a material softer than the tray body portion;    the step of arranging the semiconductor devices in the storage portions of the trays to support surfaces of the semiconductor devices on a mounting side of the body portion with the cushioning portions; and    the step of building up the tray and another tray which can be built up on the tray and arranging the cushioning portions of the tray and the other tray on both of front and rear surface sides of the semiconductor devices in the storage portions of the tray to store the semiconductor devices.    
     
     
         3 . A method of manufacturing a semiconductor device with storing semiconductor devices in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising: 
 the step of preparing the plurality of trays each having a tray body portion for connecting a plurality of storage portions; and cushioning portions arranged on bottom portions and inner walls which are contact positions between the storage portions and the semiconductor devices and formed of a material softer than the tray body portion;    the step of arranging the semiconductor devices in the storage portions of the tray and supporting surfaces or external terminals of the semiconductor devices on a mounting side of the body portion with the cushioning portions; and    the step of building up the tray and another tray which can be built up on the tray and arranging the cushioning portions of the tray and the other tray on both of front and rear surface sides of the semiconductor devices in the storage portions of the tray to store the semiconductor devices.    
     
     
         4 . A method of manufacturing a semiconductor device with storing semiconductor devices in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising: 
 the step of preparing a plurality of trays each having a tray body portion for connecting a plurality of storage portions; and cushioning portions arranged at contact positions between the storage portions and the semiconductor devices and formed of a resin material having a degree of hardness lower than that of the tray body portion;    the step of arranging the semiconductor devices in the storage portions of the tray and supporting the semiconductor devices with the cushioning portions; and    the step of building up the tray and another tray which can be built up on the tray and arranging the cushioning portions of the tray and the other tray on both of front and rear surface sides of the semiconductor devices in the storage portions of the tray to store the semiconductor devices.    
     
     
         5 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the tray in which the tray body portion and the cushioning portions are formed of a resin material to which transfer molding can be easily performed.  
     
     
         6 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the tray is used in which the tray body portion and the cushioning portions are formed of a resin material having high heat conductivity.  
     
     
         7 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the tray is used in which a plurality of projections are formed on front and rear surfaces of the cushioning portions arranged on bottom portions of the storage portions.  
     
     
         8 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the tray is used in which a plurality of projections are formed at least one surface of front and rear surfaces of the cushioning portions arranged on bottom portions of the storage portions and the other surface is formed as a flat surface.  
     
     
         9 . A method of manufacturing a semiconductor device according to    claim 7   , wherein the tray is used in which the projections of the cushioning portions are separately arranged on one or both of the front and rear surfaces of the cushioning portions.  
     
     
         10 . A method of manufacturing a semiconductor device according to    claim 7   , wherein the tray is used in which the projections of the cushioning portions are arranged at positions which are not in contact with an external terminals of the semiconductor devices on one or both of the front and rear surfaces of the cushioning portions.  
     
     
         11 . A method of manufacturing a semiconductor device according to    claim 7   , wherein the tray is used in which each of the projections of the cushioning portions is formed to have such a shape that a sectional area in the horizontal direction gradually decreases toward its distal end.  
     
     
         12 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the tray in which both the front and rear surfaces of the cushioning portions are formed as flat surfaces is used.  
     
     
         13 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the tray in which inner walls of the storage portions are formed of the same material as that of the cushioning portions is used.  
     
     
         14 . A method of manufacturing a semiconductor device with storing semiconductor devices having ball electrodes as external terminals in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising: 
 the step of preparing a plurality of trays each having a tray body portion for connecting a plurality of storage portions; and cushioning portions arranged at contact positions between the storage portions and the semiconductor devices and formed of a material softer than the tray body portion;    the step of arranging the semiconductor devices in the storage portions of the trays to support the semiconductor devices with the cushioning portions; and    the step of building up the tray and another tray which can be built up on the tray and arranging the cushioning portions of the tray and the other tray on both of front and rear surface sides of the semiconductor devices in the storage portions of the tray to store the semiconductor devices.    
     
     
         15 . A method of manufacturing a semiconductor device according to    claim 14   , wherein the tray for storing the semiconductor devices in each of which the plurality of ball electrodes are fitted in an area array arrangement over an almost entire area of an external terminal fitting surface is used.  
     
     
         16 . A method of manufacturing a semiconductor device according to    claim 14   , wherein the tray for storing the semiconductor devices in each of which the plurality of ball electrodes are fitted in an area array arrangement on a part of an external terminal fitting surface is used.  
     
     
         17 . A method of manufacturing a semiconductor device according to    claim 14   , wherein the tray is used in which projections of the cushioning portions arranged on bottom portions of the storage portions are arranged at positions which are not in contact with the ball electrodes of the semiconductor devices on one or both of front and rear surfaces of the cushioning portions.  
     
     
         18 . A method of manufacturing a semiconductor device according to    claim 15   , wherein the tray is used in which projections of the cushioning portions arranged on bottom portions of the storage portions are arranged at positions which are not in contact with the ball electrodes of the semiconductor devices on one or both of front and rear surfaces of the cushioning portions.  
     
     
         19 . A method of manufacturing a semiconductor device according to    claim 16   , wherein the tray is used in which projections of the cushioning portions arranged on bottom portions of the storage portions are arranged at positions which are not in contact with the ball electrodes of the semiconductor devices on one or both of front and rear surfaces of the cushioning portions.  
     
     
         20 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the plurality of trays are built up in a plurality of stages, the plurality of semiconductor devices are arranged on the plurality of stages, and the plurality of built-up trays are conveyed between semiconductor manufacturing steps.  
     
     
         21 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the plurality of trays are built up in a plurality of stages, the plurality of semiconductor devices are arranged on the plurality of stages, and the plurality of built-up trays are stored in a storage box and shipped.  
     
     
         22 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the trays built up in a plurality of stages in which the semiconductor devices are stored in the storage portions of one of the front and rear surfaces are turned over; the semiconductor devices are supported by the cushioning portions of the storage portions on the other surface of the tray arranged on lower side by the turning-over, thereafter, the trays arranged on upper side by the turning over are sequentially removed to expose the semiconductor devices; and an external terminals of the semiconductor devices are visually inspected.  
     
     
         23 . A method of manufacturing a semiconductor device according to    claim 1   , wherein the plurality of trays are built up in a plurality of stages; the plurality of semiconductor devices are stored on the plurality of stages; and the semiconductor devices stored in the plurality of built-up trays are subjected to a baking process together with the trays.  
     
     
         24 . A method of manufacturing a semiconductor device with storing semiconductor devices having gull-wing outer leads as external terminals in storage portions of built-up type trays having a plurality of storage portions on both front and rear surfaces to perform preservation, transportation, characteristic selection, inspection, a baking process, or shipping for the semiconductor devices, comprising: 
 the step of preparing a plurality of trays each having a tray body portion for connecting a plurality of storage portions; and cushioning portions arranged to position the semiconductor devices in the storage portions and formed of a material softer than the tray body portion;    the step of arranging the cushioning portions inside the gull-wing outer leads of the semiconductor devices and of positioning the semiconductor devices with the cushioning portions to store the semiconductor devices in the storage portions of the tray; and    the step of building up the tray and another tray which can be built up on the tray and of storing the semiconductor devices in the storage portions of the respective trays.    
     
     
         25 . A method of manufacturing a semiconductor device according to    claim 24   , wherein the plurality of trays are built up in a plurality of stages; the plurality of semiconductor devices are arranged and stored on the plurality of stages; and the plurality of built-up trays are conveyed between semiconductor manufacturing steps.  
     
     
         26 . A method of manufacturing a semiconductor device according to    claim 24   , wherein the plurality of trays are built up in a plurality of stages; the plurality of semiconductor devices are arranged and stored on the plurality of stages; and the plurality of built-up trays are stored in a storage box and shipped.  
     
     
         27 . A method of manufacturing a semiconductor device according to    claim 24   , wherein the plurality of trays are built up in a plurality of stages; the plurality of semiconductor devices are stored on the plurality of stages, and the semiconductor devices arranged and stored in the plurality of built-up trays are subjected to a baking process together with the trays.  
     
     
         28 . A method of manufacturing a semiconductor device with storing semiconductor devices in storage portions of built-up type trays having a plurality of storage portions and a tray body portion for connecting the storage portions to perform desired processes such as preservation, transportation, and inspection for the semiconductor devices, comprising: 
 the step of preparing a plurality of trays in which the plurality of storage portions have side walls and bottom surfaces connected to the side walls and the bottom surfaces are cushioning portions formed of a material softer than the tray body portion; and    the step of building up a first tray of the plurality of trays and a second tray of the plurality of trays and of storing the semiconductor devices such that the cushioning portions of the first tray and the second tray are arranged on both front and rear surface sides of the semiconductor devices in the storage portions of the first tray.    
     
     
         29 . A tray having a plurality of recessed storage portions, comprising: 
 a tray body portion for connecting a plurality of storage portions in which semiconductor devices are stored; and    cushioning portions arranged in the storage portions and formed of a material softer than the tray body portion;    wherein when the tray and another tray which can be built up on the tray while the semiconductor devices are stored in the storage portions of the tray, the cushioning portions are arranged on both front and rear surface sides of the semiconductor devices, and the cushioning portions on at least one of both the front and rear surface sides are in contact with the semiconductor devices.    
     
     
         30 . A tray according to    claim 29   , wherein the semiconductor devices have sealing body portions in which semiconductor chips are mounted on wiring boards and which have sealing body portions for sealing the semiconductor chips, a plurality of external terminals are arranged in an area array arrangement on the wiring boards; and, when the tray in which the semiconductor devices are stored in the storage portions and the other tray are built up, of the cushioning portions arranged on both the front and rear surface sides of the semiconductor devices, the cushioning portions on at least one of both the front and rear surface sides are in contact with the sealing body portions of the semiconductor devices.  
     
     
         31 . A tray according to    claim 29   , wherein the semiconductor devices have sealing body portions in which semiconductor chips are mounted on wiring boards and which have sealing body portions for sealing the semiconductor chips; a plurality of external terminals are arranged in an area array arrangement on the wiring boards; and, when the tray in which the semiconductor devices are stored in the storage portions and the other tray are built up, of the cushioning portions arranged on both the front and rear surface sides of the semiconductor devices, the cushioning portions on one of both the front and rear surface sides support the sealing body portions of the semiconductor device; and the cushioning portions on the other of both the front and rear surface sides support outer peripheral portions of external terminal fitting surfaces of the wiring boards.