Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck

Abstract

A method and apparatus for fabricating a wafer spacing mask on a workpiece support chuck. Such apparatus is a central body containing a plurality of apertures that is positioned atop the workpiece support chuck and an outer ring shaped body positioned on a flange of the workpiece support chuck while material is deposited onto the apparatus and through the apertures onto chuck. Upon completion of the deposition process, the central body and ring shaped body are removed from the workpiece support chuck leaving deposits of the material to form the wafer spacing mask.

What is claimed is:  
     
         1 . Apparatus for fabricating a wafer spacing mask on a substrate support chuck, said substrate support chuck having a support surface and a flange extending radially outward of said support surface, said apparatus comprising: 
 a central body, disposed upon said support surface; and an outer body disposed upon said flange.    
     
     
         2 . The apparatus of    claim 1    wherein said central body further comprises a plurality of apertures disposed therein and a plurality of slots disposed about a periphery of said central body.  
     
     
         3 . The apparatus of    claim 2    wherein said plurality of apertures are 270, arranged as a pattern of concentric rings and said plurality of slots is 9.  
     
     
         4 . The apparatus of    claim 1    wherein said outer body is ring shaped.  
     
     
         5 . The apparatus of    claim 1    wherein said central body and said outer body are fabricated from the same material.  
     
     
         6 . The apparatus of    claim 5    wherein said material is selected from the group consisting of ceramic, silicon, aluminum nitride and boron nitride.  
     
     
         7 . The apparatus of    claim 6    wherein said material is the ceramic, alumina.  
     
     
         8 . The apparatus of    claim 1    further comprising an alignment pin support disposed below said central body.  
     
     
         9 . The apparatus of    claim 8    wherein the alignment pin support has at least two alignment pins projecting upward therefrom.  
     
     
         10 . The apparatus of    claim 9    wherein said at least two alignment pins communicate with a corresponding number of alignment bores disposed in the central body.  
     
     
         11 . The apparatus of    claim 9    wherein said at least two alignment pins are disposed at angles of +60° and −60° respectively with respect to a y-axis of the alignment pin support.  
     
     
         12 . The apparatus of    claim 8    wherein said alignment pin support is a C-shaped body having a first end and a second end wherein the first end transitions to an extension tab.  
     
     
         13 . The apparatus of    claim 12    wherein the extension tab is received in a connector of a chamber assembly.  
     
     
         14 . A method of fabricating a wafer spacing mask comprising the steps of: 
 positioning a plate on a support surface of a workpiece support chuck, where said plate contains a pattern of apertures;    depositing a material onto the plate and through said apertures to form deposits upon the support surface of the workpiece support chuck; and    removing said plate and leaving said deposits of the material upon said support surface of said workpiece support chuck to form the wafer spacing mask.    
     
     
         15 . The method of    claim 14    wherein said plate contains a plurality of slots disposed at a periphery of said plate and said depositing step further comprises the step of depositing the material through the slots and onto a flange that radially extends from the workpiece support chuck.  
     
     
         16 . The method of    claim 14    wherein said depositing step further comprises the step of using a physical vapor deposition process to deposit the material.  
     
     
         17 . The method of    claim 14    wherein the material is titanium.