Support structure for packaging

Abstract

A support structure for packaging is provided for containing, storing and transporting electronic components like liquid crystal modules. The structure includes a bottom plate and first and second side plates provided at respective sides of the bottom plate. Side surfaces of the bottom plate constitute first inclined planes slanted at a first degree. End surfaces of the first and second side plates on the bottom plate side constitute second inclined planes slanted at a second degree. The first and second degrees are selected such that, when the first and second side plates are erected to cause the first and second inclined planes to closely contact with each other, the first and second side plates are prevented from being bent inwards more than 90 degrees.

What is claimed is:  
     
         1 . A support structure for packaging, formed of synthetic resin, for containing an electronic component, comprising: 
 a bottom plate supporting said electronic component from beneath; and    a first side plate and a second side plate extending outwards from respective sides of said bottom plate and erected to form support members supporting said electronic component from sides,    said bottom plate having end surfaces each forming a first inclined plane slanted at a first degree,    said first and second side plates having end surfaces on said bottom plate side each forming a second inclined plane slanted at a second degree, and    said first degree and said second degree being selected such that, when said first and second side plates are erected to cause said first inclined plane and said second inclined plane to closely contact with each other, said first and second side plates are prevented from being bent inwards more than 90 degrees.    
     
     
         2 . A support structure for packaging, formed of synthetic resin, for containing an electronic component, comprising: 
 a bottom plate supporting said electronic component from beneath;    a first side plate and a second side plate extending outwards from respective sides of said bottom plate and erected to form support members supporting said electronic component from sides, 
 said first side plate having an outer end surface forming a first inclined plane, and  
 said second side plate having an outer end surface forming a second inclined plane; and  
   a top plate covering said erected first and second side plates on top, 
 said top plate having a third inclined plane for close contact with said first inclined plane and a fourth inclined plane for close contact with said second inclined plane,  
   said first inclined plane and said third inclined plane being connected with each other by engagement of a pair of concave portion and convex portion provided separately at said first and third inclined planes, respectively, and    said second inclined plane and said fourth inclined plane being connected with each other by engagement of a pair of concave portion and convex portion provided separately at said second and fourth inclined planes, respectively.