Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device

Abstract

A memory TCP loaded with four chips (1-bank 16-bit type) is constructed by a tape of one two-layer wiring layer structure, four chips mounted to this tape, etc. Common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side. The common signal terminals on the two sides are electrically connected to each other common signal wiring. Further, in a DIMM in which this memory TCP is mounted to front and rear sides of a substrate, plural external terminals are formed on one long side of the rectangular substrate, and the memory TCP is mounted such that the independent signal terminal of the memory TCP is arranged along an arranging direction of these external terminals.

What is claimed is:  
     
         1 . A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring.  
     
     
         2 . A semiconductor device according to    claim 1   , wherein pads of said chips are set such that a pad connected to said common signal wiring is arranged far from said independent signal terminal, and a pad connected to independent signal wiring is arranged near said independent signal terminal.  
     
     
         3 . A semiconductor device according to    claim 1   , wherein said common signal wiring and independent signal wiring formed on said tape are located on the same face, and do not cross each other.  
     
     
         4 . A semiconductor device according to    claim 1   , wherein said tape is a one-layer tape.  
     
     
         5 . A semiconductor device according to    claim 1   , wherein said tape is a two-layer tape.  
     
     
         6 . A semiconductor device according to    claim 5   , wherein a ground electric potential plane pattern and a power electric potential plane pattern are formed on a face opposed to a forming face of said common signal wiring and independent signal wiring in said two-layer tape.  
     
     
         7 . A semiconductor device according to    claim 5   , wherein an insulating material is interposed between a main face of said chip and signal wiring of said two-layer tape.  
     
     
         8 . A semiconductor device according to    claim 1   , wherein a passive element is mounted to said tape.  
     
     
         9 . A semiconductor device according to    claim 1   , wherein a frame is arranged on one face of said tape so as to surround said chip.  
     
     
         10 . A semiconductor device according to    claim 9   , wherein said frame is constructed by plastic or a metal having a good heat radiating property.  
     
     
         11 . A semiconductor device according to    claim 1   , wherein a metallic plate is fixedly attached to said chip.  
     
     
         12 . A semiconductor device according to    claim 1   , wherein a recognizing mark pattern is formed in said tape.  
     
     
         13 . A semiconductor device according to    claim 1   , wherein an index for pin display is formed in said tape.  
     
     
         14 . A semiconductor device according to    claim 1   , wherein said independent signal terminal and another independent signal terminal electrically unconnected to the chip mounted to said tare are arranged on said another side.  
     
     
         15 . A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry.  
     
     
         16 . A semiconductor device according to    claim 15   , wherein two mirror symmetry tape carrier type semiconductor devices are formed by cutting said tape along a central line on one side on which said independent signal terminal is arranged.  
     
     
         17 . A semiconductor device according to    claim 16   , wherein a recognizing mark pattern is formed in said tape of each of said two mirror symmetry tape carrier type semiconductor devices.  
     
     
         18 . A semiconductor device according to    claim 16   , wherein an index for pin display is formed in said tape of each of said two mirror symmetry tape carrier type semiconductor devices.  
     
     
         19 . A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and a lead continuously extends to said common signal terminals and said independent signal terminal and is projected from said tape, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring.  
     
     
         20 . A semiconductor device according to    claim 19   , wherein pads of said chips are set such that a pad connected to said common signal wiring is arranged far from said independent signal terminal, and a pad connected to independent signal wiring is arranged near said independent signal terminal.  
     
     
         21 . A semiconductor device according to    claim 19   , wherein said common signal wiring and independent signal wiring formed on said tape are located on the same face, and do not cross each other.  
     
     
         22 . A semiconductor device according to    claim 19   , wherein a passive element is mounted to said tape.  
     
     
         23 . A semiconductor device according to    claim 19   , wherein plural support leads electrically unconnected to the mounted chip are arranged on another side opposed to the lead of said independent signal terminal.  
     
     
         24 . A semiconductor device according to    claim 19   , wherein a frame is arranged on one face of said tape so as to surround said chip.  
     
     
         25 . A semiconductor device according to    claim 24   , wherein said frame is constructed by plastic or a metal having a good heat radiating property.  
     
     
         26 . A semiconductor device according to    claim 19   , wherein a metallic plate is fixedly attached to said chip.  
     
     
         27 . A semiconductor device according to    claim 19   , wherein a recognizing mark pattern is formed in said tape.  
     
     
         28 . A semiconductor device according to    claim 19   , wherein an index for pin display is formed in said tape.  
     
     
         29 . A tape carrier type semiconductor device of a laminating type for mounting plural chips to one tape, wherein a semiconductor device having common signal terminals arranged on one set of two opposed sides, a first independent signal terminal arranged on another side, and a second independent signal terminal electrically unconnected to the chips mounted to said tape is laminated, and the first independent signal terminal at an upper stage and the second independent signal terminal at a lower stage are connected to each other, and the second independent signal terminal at the upper stage and the first independent signal terminal at the lower stage are connected to each other.  
     
     
         30 . A semiconductor device of a laminating type according to    claim 29   , wherein said laminated semiconductor device is laminated by connecting said signal terminals formed on said tape to each other.  
     
     
         31 . A semiconductor device of a laminating type according to    claim 29   , wherein said laminated semiconductor device has a structure in which the signal terminals are formed on the tape at the lower stage, and also has a structure constructed by a lead terminal continuously extending from said signal terminals at the upper stage, and these structures are laminated with each other.  
     
     
         32 . A semiconductor device of a laminating type according to    claim 29   , wherein said laminated semiconductor device has a structure having lead terminals respectively continuously extending from the signal terminals, and is laminated by connecting said lead terminals to each other.  
     
     
         33 . A semiconductor device of a laminating type according to    claim 29   , wherein a recognizing mark pattern is formed in said tape.  
     
     
         34 . A semiconductor device of a laminating type according to    claim 29   , wherein an index for pin display is formed in said tape.  
     
     
         35 . A semiconductor module mounting plural tape carrier type semiconductor devices thereto in which plural external terminals are formed on one long side of a rectangular substrate, and common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring, and plural chips are mounted to one tape, wherein said independent signal terminal is arranged along an arranging direction of said external terminals.  
     
     
         36 . A semiconductor module according to    claim 35   , wherein a resin seal type semiconductor device is mounted between said external terminals and said plural tape carrier type semiconductor devices.  
     
     
         37 . A semiconductor module according to    claim 35   , wherein the semiconductor module is constructed by mixing said tape carrier type semiconductor device mounting four chips onto one tape, and a tape carrier type semiconductor device in which common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry, and two chips are mounted onto one tape.  
     
     
         38 . A semiconductor module according to    claim 35   , wherein a mounting face of said substrate and a chip main face are mounted such that these faces are opposed to each other.  
     
     
         39 . A semiconductor module mounting plural tape carrier type semiconductor devices thereto in which plural external terminals are formed on one long side of a rectangular substrate, and common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and a lead continuously extends to said common signal terminals and said independent signal terminal and is projected from a tape, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring, and plural chips are mounted to one tape, wherein said independent signal terminal is arranged along an arranging direction of said external terminals.  
     
     
         40 . A semiconductor module according to    claim 39   , wherein a resin seal type semiconductor device is mounted between said external terminals and said plural tape carrier type semiconductor devices.  
     
     
         41 . A semiconductor module according to    claim 39   , wherein the semiconductor module is constructed by mixing said tape carrier type semiconductor device mounting four chips onto one tape, and a tape carrier tripe semiconductor device in which common signal terminals are arranged on one see of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry, and two chips are mounted onto one tape.  
     
     
         42 . A semiconductor module according to    claim 39   , wherein a mounting face of said substrate and a chip main face are mounted such that these faces are facing each other.  
     
     
         43 . A semiconductor module constructed by laminating a semiconductor device in which plural external terminals are formed on one long side of a rectangular substrate, and common signal terminals are arranged on one set of two opposed sides, and a first independent signal terminal is arranged on another side, and a second independent signal terminal electrically unconnected to a chip mounted to a tape is arranged; and mounting plural tape carrier type semiconductor devices in which the first independent signal terminal at an upper stage and the second independent signal terminal at a lower stage are connected to each other, and the second independent signal terminal at the upper stage and the first independent signal terminal at the lower stage are connected to each other, and plural chips are mounted to one tape, wherein said independent signal terminal is arranged along an arranging direction of said external terminals.  
     
     
         44 . A semiconductor module according to    claim 43   , wherein each of said plural tape carrier type semiconductor devices is laminated by connecting said signal terminals formed on said tape to each other.  
     
     
         45 . A semiconductor module according to    claim 43   , wherein each of said plural tape carrier type semiconductor devices has a structure in which the signal terminals are formed on the tape at the lower stage, and also has a structure constructed by a lead terminal continuously extending from said signal terminals at the upper stage, and these structures are laminated with each other.  
     
     
         46 . A semiconductor module according to    claim 43   , wherein each of said plural tape carrier type semiconductor devices has a structure having lead terminals respectively continuously extending from the signal terminals, and is laminated by connecting said lead terminals to each other.  
     
     
         47 . A semiconductor module of a lead-on-board structure according to    claim 43   , wherein each of said plural tape carrier type semiconductor devices has a structure having lead terminals respectively continuously extending from the signal terminals, and is laminated onto the mounting substrate such that said lead terminal of the tape carrier type semiconductor device mounted at the upper stage lies across said lead terminal of the tape carrier type semiconductor device mounted at the lower stage.  
     
     
         48 . A semiconductor module according to    claim 47   , wherein a lead of said tape carrier type semiconductor device at the upper stage is longer in said lead-on-board structure.  
     
     
         49 . A semiconductor module according to    claim 43   , wherein a resin seal type semiconductor device is mounted between said external terminals and said plural tape carrier terse semiconductor devices.  
     
     
         50 . A semiconductor module according to claim  43 , wherein the semiconductor module is constructed by mixing said tape carrier type semiconductor device mounting four chips onto one tape, and a tape carrier type semiconductor device in which common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry, and two chips are mounted onto one tape.  
     
     
         51 . A semiconductor module according to    claim 43   , wherein a mounting face of said substrate and a chip main face are mounted such that these faces are facing each other.  
     
     
         52 . A manufacturing method of a semiconductor device comprising a process for preparing a series of tapes in which plural semiconductor chips are mounted to the series of tapes, and common signal terminals are formed so as to divide said semiconductor chips every plural semiconductor chips, and plural independent signal terminals are formed along one side of said plural semiconductor chips in a direction perpendicular to said common signal terminals; and a process for forming the common signal terminals along both sides of said plural semiconductor chips by cutting the tapes approximately along a central line of said common signal terminals so as to divide said common signal terminals into two portions; wherein a tape carrier type semiconductor device having said plural semiconductor chips on one tape is completed by cutting the tapes so as to expose said plural independent signal terminals to a side face of said tapes.  
     
     
         53 . A manufacturing method of a semiconductor device according to    claim 52   , wherein the tape carrier type semiconductor device mounting said plural chips thereto is divided into two portions between said semiconductor chips approximately at centers of said common signal terminals on both sides.  
     
     
         54 . A manufacturing method of a semiconductor device according to    claim 52   , wherein the tapes are cut every four chips when the tape carrier type semiconductor device mounting said plural chips thereto is completed.  
     
     
         55 . A manufacturing method of a semiconductor device according to    claim 54   , wherein the tape carrier type semiconductor device mounting said four chips thereto is cut in a unit of two chips between said semiconductor chips approximately at a center of said common signal terminals.