US2001025805A1PendingUtilityA1
Wafer Case
Priority: Feb 22, 1999Filed: Feb 16, 2000Published: Oct 4, 2001
Est. expiryFeb 22, 2019(expired)· nominal 20-yr term from priority
H10P 72/1922H10P 72/1911H10P 72/1902B65D 1/22
30
PatentIndex Score
0
Cited by
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References
0
Claims
Abstract
A wafer case for holding a wafer includes a case body having an opening for receiving the waver, and a lid for closing said opening of the case body. The case body and lid are made of dust-free paper. Further, the case body has a lid fitting portion, over which said lid fits; and a plurality of through holes are formed in the lid fitting portion at equal interval.
Claims
exact text as granted — not AI-modifiedWhat is claimed is
1 . A wafer case for holding a wafer comprising:
a case body having an opening for receiving the waver; and a lid for closing said opening of said case body, wherein said case body and lid are made of dust-free paper.
2 . The wafer case claimed in claim 1 , wherein:
said case body has a lid fitting portion, over which said lid fits; and a plurality of through holes are formed in said lid fitting portion.
3 . The wafer case claimed in claim 1 , wherein said wafer case has a circular cross section.
4 . The wafer case claimed in claim 1 , wherein said wafer case has a square cross section.
5 . The wafer case as claimed in claim 1 , wherein said dust-free paper is made from paper stock obtained as a result of resin binder (for treatment for preventing dust from being created) and sizing agent (for preventing ink from running) being mixed with pulp, which is the raw material, during the paper manufacturing process.Join the waitlist — get patent alerts
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