Phenol novolak resin, production process thereof, and positive photoresist composition using the same
Abstract
A phenol novolak resin has a peak intensity ratio of ortho-ortho bond (o-o)/ortho-para bond (o-p)/para-para bond (p-p) in a resin structure not substantially varying in each molecular weight fraction and has a weight average molecular weight (Mw) of 3000 to 20000 in terms of polystyrene, which peak intensity ratio is detected by 13 C-NMR analysis. The phenol novolak resin can form both dense pattern and isolation pattern with good shapes in the formation of a fine resist pattern of not more than 0.35 μm and has satisfactory sensitivity, definition, and focal depth range properties, and has a resin composition being uniform in each molecular weight fraction. A process for producing the phenol novolak resin, and a positive photoresist composition using the resin are also provided.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A phenol novolak resin:
having a peak intensity ratio of ortho-ortho bond (o-o)/ortho-para bond (o-p)/para-para bond (p-p) not substantially varying in each molecular weight fraction, said peak intensity ratio being detected in a resin structure by 13 C-NMR analysis; and having a weight average molecular weight (Mw) of 3000 to 20000 in terms of polystyrene.
2 . A phenol novolak resin according to claim 1 , comprising at least two selected from phenol constitutional units represented by the following formulae (I) to (IV):
3 . A phenol novolak resin:
having a peak intensity ratio of ortho-ortho bond (o-o)/ortho-para bond (o-p)/para-para bond (p-p) in a range of 3.0-5.0/2.0-3.5/1, said peak intensity ratio being detected in a resin structure by 13 C-NMR analysis and not substantially varying in each molecular weight fraction; comprising phenol constitutional units represented by the formulae (I) and (III) as defined in claim 1 and the following formula (V); and having a weight average molecular weight (Mw) of 3000 to 20000 in terms of polystyrene.
4 . A phenol novolak resin:
having a peak intensity ratio of ortho-ortho bond (o-o)/ortho-para bond (o-p)/para-para bond (p-p) in a range of 5.0-8.5/2.5-4.5/1, said peak intensity ratio being detected in a resin structure by 13 C-NMR analysis; comprising phenol constitutional units represented by the formulae (I) and (II) as defined in claim 1 and the following formula (VI); and having a weight average molecular weight (Mw) of 3000 to 20000 in terms of polystyrene.
5 . A phenol novolak resin according to any one of claims 1 to 3 , wherein a ratio of the peak intensities of para-para bond (p-p) to the total of the peak intensities of ortho-ortho bond, ortho-para bond, and para-para bond [(o-o)+(o-p)+(p-p)] is in a range of 10% to 20%.
6 . A phenol novolak resin according to claim 4 , wherein a ratio of the peak intensities of para-para bond (p-p) to the total of the peak intensities of ortho-ortho bond, ortho-para bond, and para-para bond [(o-o)+(o-p)+(p-p)] is in a range of 5% to 15%.
7 . A phenol novolak resin according to any one of claims 1 to 6 , wherein a resin film formed by the use of the phenol novolak resin dissolves in a 2.38% by weight aqueous tetramethylammonium hydroxide solution at 25° C. at a rate of 0.01 to 0.001 μm/s.
8 . A process for producing a phenol novolak resin, comprising the steps of:
(a) subjecting a phenol to a polycondensation reaction in the presence of an acid catalyst; (b) removing water from a reaction system; (c) decomposing, in the presence of an acid catalyst, the polycondensation product obtained in the step (a); and (d) subjecting the resulting product to a polycondensation reaction with an aldehyde or a ketone.
9 . A positive photoresist composition comprising a phenol novolak resin according to any one of claims 1 to 7 , and a 1,2-naphthoquinonediazide-group-containing compound.Join the waitlist — get patent alerts
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