Method for applying photoresist to a base body surface

Abstract

An applicator device for applying photoresist to a surface of a base body having a receiving device therefor, including a photoresist feeder movable relative to the base body, the feeder being a point source device, and a device for performing a defined movement of the base body, comprising a conically shaped tip formed on the point source device for applying photoresist in a defined spot.

We claim:  
     
         1 . A method for applying photoresist to a surface of a base body, which comprises displacing a photoresist feeder and the surface of the base body to be provided with the photoresist relative to one another in one of a predeterminable and a predetermined manner, adjusting the layer thickness of the photoresist on the surface of the base body by at least one of varying the displacement speed of the photoresist feeder, varying the permeability of at least one point source device of the photoresist feeder, and varying the rotational speed of the base body, applying the photoresist in a defined spot, and transporting photoresist from the point source device to the surface of the base body by one of gravity flow and regulating the feed pressure of the photoresist from a supply chamber.  
     
     
         2 . The method according to    claim 1   , which includes guiding the photoresist through one of a conically tapering fiber bundle and a capillary system provided with a conically tapering tip.  
     
     
         3 . The method according to    claim 1   , which includes controlling at least one of the application of photoresists of different viscosities and compositions, and the application of one of the groups of primers and other adhesion promoters, so that a cohesive layer is formed in a defined region or over the entire surface of the base body.  
     
     
         4 . The method according to    claim 1   , which includes applying the photoresist in a chamber wherein the base body and the photoresist feeder are disposed, and which contains saturated solvent vapor.  
     
     
         5 . The method according to    claim 1   , which includes, on the surface of the base body, at least one of applying different resist layer thicknesses and applying the photoresist homogeneously in at least one of a small, defined region and partial fields in locally or linearly limited form.  
     
     
         6 . The method according to    claim 1   , which includes applying the photoresist in droplet form, with a layer thickness of up to 10 μm, to the surface of the base body by at least one of feeding the photoresist from a distance thereto and by having the photoresist directly contact the surface of the base body.