US2001019780A1PendingUtilityA1

Metal foil with carrier and method for manufacturing the same

Assignee: MITSUI MINING & SMELTING COPriority: Mar 3, 2000Filed: Feb 27, 2001Published: Sep 6, 2001
Est. expiryMar 3, 2020(expired)· nominal 20-yr term from priority
Y10T428/12431Y10T428/12438H05K 3/025C25D 1/04C25D 7/0614
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Claims

Abstract

An object of the present invention is to provide a technology for preventing wrinkles on metal foils such as nickel, tin, cobalt, chromium and iron from being generated in order to facilitate their handling. The object is accomplished by using a carrier foil manufactured by bonding a carrier foil layer with a metal foil layer via an organic adhesive interface layer, wherein a metal foil layer comprising one of nickel, tin, cobalt, chromium, lead, iron and zinc, or an alloy as a combination of two or more of them or an alloy of them is used for the metal foil with carrier.

Claims

exact text as granted — not AI-modified
1 . A metal foil with carrier manufactured by bonding a carrier foil layer and a metal foil layer via an organic adhesive interface layer, 
 wherein the metal foil layer comprises either one of nickel, tin, cobalt, chromium, lead, iron and zinc, or an alloy as a combination of two or more of them.    
     
     
         2 . A metal foil with carrier manufactured by bonding a carrier foil layer and a metal foil layer via an organic adhesive interface layer, 
 wherein the metal foil layer has a layer structure of two or more of nickel, tin, cobalt, chromium, lead, iron and zinc.    
     
     
         3 . A metal foil with carrier according to    claim 1    or    2   , wherein the organic adhesive interface layer is formed using one or plural compounds selected from nitrogen containing organic compounds, sulfur containing organic compounds and carboxylic acids.  
     
     
         4 . A method for manufacturing metal foil with carrier a according to    claims 1    to    3   , wherein an organic adhesive interface layer is formed on the surface of the carrier foil, and a metal foil layer is formed on the organic adhesive interface layer by electrodeposition.

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