Semiconductor device measuring socket capable of adjusting contact positions, and semiconductor device manufacturing method using the same

Abstract

In a semiconductor device measuring socket, contact positions are adjustable by employing spacers. The semiconductor device measuring socket comprising: a wiring pattern board on which a test circuit is formed; a substantially S-shaped contact for electrically connecting the wiring pattern board to external leads arrayed on a semiconductor device; a supporting member for elastically supporting the contact under tiltable condition; a socket main body for storing thereinto the contact and the supporting member and for mounting the wiring pattern board on a lower portion of the socket main body; and adjusting means for adjusting a tilting amount of the contact with respect to the socket main body. When the wiring pattern board is mounted on the socket main body, a lower end portion of the contact which is projected from the lower surface of the socket main body is depressed by the wiring pattern board to thereby tilt the contact, whereby a contact position between the external lead and the contact is determined.

What is claimed is:  
     
         1 . A semiconductor device measuring socket comprising: 
 a wiring pattern board on which a test circuit is formed;    a substantially S-shaped contact for electrically connecting said wiring pattern board to external leads arrayed on a semiconductor device;    a supporting member for elastically supporting said contact under tiltable condition;    a socket main body for storing thereinto said contact and said supporting member and for mounting said wiring pattern board on a lower portion of said socket main body; and    adjusting means for adjusting a tilting amount of said contact with respect to said socket main body;    wherein:    when said wiring pattern board is mounted on said socket main body, a lower end portion of said contact which is projected from the lower surface of said socket main body is depressed by said wiring pattern board to thereby tilt said contact, whereby a contact position between said external lead and said contact is determined.    
     
     
         2 . A semiconductor device measuring socket as claimed in    claim 1    wherein: 
 said adjusting means is provided between said socket main body and said wiring pattern board, and is made of a thin film spacer having a thickness smaller than a projection amount of said contact which is projected from the lower surface of said socket main body.  
 
     
     
         3 . A semiconductor device measuring socket as claimed in    claim 1   , further comprising: 
 fastening means for detachably fastening said wiring pattern board to said socket main body.    
     
     
         4 . A semiconductor device measuring socket as claimed in    claim 1    wherein: 
 a projection portion is formed on an outer peripheral region of a lower curved portion of said contact so as to additionally emphasize the adjusting effect achieved by said adjusting means, said projection portion projecting toward said wiring pattern board.  
 
     
     
         5 . A method for manufacturing a semiconductor device, comprising a step for measuring said semiconductor device by employing a semiconductor device measuring socket having: a wiring pattern board on which a test circuit is formed; a substantially S-shaped contact for electrically connecting said wiring pattern board to external leads arrayed on a semiconductor device; a supporting member for elastically supporting said contact under tiltable condition; a socket main body for storing thereinto said contact and said supporting member and for mounting said wiring pattern board on a lower portion of said socket main body; wherein: 
 a step for adjusting a tilting amount of said contact by employing adjusting means provided on said semiconductor device measuring socket is executed before said semiconductor device measuring step in such a case that when said wiring pattern board is mounted on said socket main body, a lower end portion of said contact which is projected from the lower surface of said socket main body is depressed by said wiring pattern board to thereby tilt said contact, whereby a contact position between said external lead and said contact is determined.    
     
     
         6 . A semiconductor device manufacturing method as claimed in    claim 5    wherein: 
 said adjusting means is provided between said socket main body and said wiring pattern board, and is made of a thin film spacer having a thickness smaller than a projection amount of said contact which is projected from the lower surface of said socket main body.  
 
     
     
         7 . A semiconductor device manufacturing method as claimed in    claim 5   , wherein: 
 fastening means for detachably fastening said wiring pattern board to said socket main body is further provided.    
     
     
         8 . A semiconductor device manufacturing method as claimed in    claim 5    wherein: 
 a projection portion is formed on an outer peripheral region of a lower curved portion of said contact so as to additionally emphasize the adjusting effect achieved by said adjusting means, said projection portion projecting toward said wiring pattern board.