Connecting material and mounting method which uses same

Abstract

A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.

What is claimed is:  
     
         1 . A connecting material containing a thermosetting resin, wherein the surface tension thereof at 25° C. is 25 to 40 mN/m.  
     
     
         2 . The connecting material according to    claim 1   , containing a surfactant so as to allow the surface tension at 25° C. to be 25 to 40 mN/m.  
     
     
         3 . The connecting material according to    claim 2   , wherein the surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant.  
     
     
         4 . The connecting material according to    claim 3   , wherein the ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.  
     
     
         5 . The connecting material according to any of    claims 1    to    4   , further containing a latent curing agent.  
     
     
         6 . The connecting material according to any of    claims 1    to    5   , containing electrically conductive particles for use in anisotropic conductive connection.  
     
     
         7 . The connecting material according to any of    claims 1    to    6   , wherein [the connecting material] is in the form of a liquid or paste.  
     
     
         8 . A mounting method, wherein the connecting material according to any    claims 1    to    7    is supplied onto a wiring circuit board on which a bare IC chip is to be mounted, the bare IC chip is positioned thereon, and heat and pressure are applied to connect the bare IC chip to the wiring circuit board.