Production of structured electrodes

Abstract

The present invention relates to a new method and apparatus for structure electrodes of electro-luminescent components used displays and the like. The electrodes are structured in such a way that its layers are protected during structuring and the components may be tightly packed together to improve display resolution. The method includes the steps of: on a substrate ( 1 ) at least two layers ( 3, 4 ) are applied, whereas the first layer ( 3 ) is electrically insulated and is not damaged when the second layer ( 4 ) is applied and between both layers a defined boundary is maintained, and whereby the first layer shows a higher solvent rate in a liquid solvent than the second layer and the second layer is structurable and cross-linked; the second layer ( 4 ) is structured and the structure is transferred onto the first layer ( 3 ) and then the second layer ( 4 ) is cross-linked or the second layer ( 4 ) is first structured and cross-linked and then the structure is transferred onto the first layer ( 3 ), whereas the second layer shows a larger structure width than the first layer and the difference in the structure width of both layers is kept during the cross-linking. On the second layer ( 4 ) the electrode ( 6 ) is deposited.

I claim:  
     
         1 . A method of producing structured electrodes for organic electro-luminescent displays, comprising the steps of: 
 forming a first layer on a substrate, said first layer having a first width and a first solvent rate;    overcoating said first layer with a protective layer;    forming a second layer on said protective layer, said second layer having a second width and a second solvent rate;    etching said first and second layer with at least one solvent such that said second width is greater than said first width; and    forming an electrode on said second layer.    
     
     
         2 . The method according to    claim 1   , further comprising the step of: forming at least one organic active layer on said second layer, said active layer being formed below said electrode.  
     
     
         3 . The method according to    claim 1   , wherein said first solvent rate is higher than said second solvent rate.  
     
     
         4 . The method according to    claim 1   , wherein said step of forming a first layer further comprises the step of: forming a bottom electrode on said substrate, said bottom electrode being formed below said first layer.  
     
     
         5 . The method according to    claim 1   , wherein the step for forming a second layer further comprises the step of: 
 after formation of said second layer, cross linking said second layer.    
     
     
         6 . The method according to    claim 1   , wherein the step of forming a protective layer, further comprises the step of: cross linking a second layer.  
     
     
         7 . The method according to    claim 1   , wherein said protective layer electrically insulates said first layer from said second layer.  
     
     
         8 . The method according to    claim 1   , wherein said first layer comprises an organic layer.  
     
     
         9 . The method according to    claim 1   , wherein said second layer comprises an organic layer.  
     
     
         10 . The method according to claim i, wherein said first and second layers comprise an organic layer.  
     
     
         11 . The method according to    claim 8   , wherein said first layer comprises a photoresist.  
     
     
         12 . The method according to    claim 9   , wherein said second layer comprises a photoresist.  
     
     
         13 . The method according to    claim 10   , wherein said first and second layer comprise a photoresist.  
     
     
         14 . The method according to    claim 11   , wherein said photoresist is a positive photoresist.  
     
     
         15 . The method according to    claim 12   , wherein said photoresist is a positive photoresist.  
     
     
         16 . The method according to    claim 12   , wherein said photoresist is a negative photoresist.  
     
     
         17 . the method according to    claim 13   , wherein the step of forming a first layer further comprises the step of: 
 exposing said first layer to radiation.    
     
     
         18 . The method according to    claim 14   , wherein said photoresist comprises one of polyglutarimid and polybenzoxazol.  
     
     
         19 . The method according to    claim 15   , wherein said photoresist comprises one of Novolak and Diaxochinon.  
     
     
         20 . The method according to    claim 16   , wherein said photoresist comprises one of Novolak, Integrater, and Photoacid.  
     
     
         21 . The method according to    claim 1   , wherein said first layer comprises a photoresist and said photoresist comprises an alkaline developable non-photo-sensitive polyamide.  
     
     
         22 . The method according to claim l wherein said second layer comprises a photoresist and said photoresist comprises an alkaline developable non-photo-sensitive polyamide.  
     
     
         23 . The method according to    claim 1   , wherein both said first and second layers comprise a photoresist and said photoresist comprises an alkaline developable non-photo-sensitive polyamide.  
     
     
         24 . The method according to    claim 1   , further comprising the steps of: 
 forming a second active organic layer on said substrate adjacent to at least one of said first layers; and    forming a second top electrode on a top surface area of said second active organic layer.    
     
     
         25 . The method according to    claim 24   , wherein said top surface area is maximized within an area having at least two borders defined by planes tangential to said at least two of said second layers.  
     
     
         26 . The method according to    claim 24   , wherein said top electrode and second top electrode comprise a metal.  
     
     
         27 . The method according to    claim 24   , wherein said top electrode and second top electrode comprise a metal coating.  
     
     
         28 . The method according to    claim 24   , wherein said top electrode and second top electrode comprise a dielectrical layer.  
     
     
         29 . A method of producing structured electrodes for organic electro-luminescent displays, comprising the steps of: 
 first forming a bottom electrode on a semiconductor substrate;    second forming a first layer on said bottom electrode, said first layer having a first width;    third overcoating said first layer with a protective layer;    fourth forming a second layer on said protective layer, said second layer having a second width;    fifth etching said first and second layer such that said second width is greater than said first width;    sixth forming an organic active layer on said second layer; and    seventh forming a top electrode on said second layer.    
     
     
         30 . The method according to    claim 29   , further comprising the steps of: 
 forming a second active organic layer on said substrate adjacent to at least one of said first layers; and    forming a second top electrode on a top surface area of said second active organic layer.    
     
     
         31 . The method according to    claim 30   , wherein said top surface area is maximized within an area having at least two borders defined by planes tangential to said at least two of said second layers.  
     
     
         32 . An optical display comprising a plurality of organic electro-luminescent components having structured electrodes, said components comprising: 
 a substrate;    at least one first layer formed on said substrate, said first layer having a first width;    a protective layer overcoated on top of said first layer;    a second layer formed on said protective layer, said second layer having a second width, said second width being greater than said first width;    an active organic layer formed on top of said second layer; and    a top electrode formed on top of said active organic layer.    
     
     
         33 . The apparatus according to    claim 32   , wherein the bottom electrode is transparent.  
     
     
         34 . The apparatus according to    claim 32   , wherein said protective layer is an electrically insulating layer.  
     
     
         35 . The apparatus according to    claim 32   , the first layer has a first solvent rate the second layer has a second solvent rate and said first solvent rate is higher than said second solvent rate.  
     
     
         36 . The apparatus according to    claim 32   , wherein the second layer is cross linked.  
     
     
         37 . The apparatus according to    claim 32   , wherein said first layer comprises an organic layer.  
     
     
         38 . The apparatus according to    claim 32   , wherein said second layer comprises an organic layer.  
     
     
         39 . The apparatus according to    claim 32   , wherein said first and second layers comprise an organic layer.  
     
     
         40 . The apparatus according to    claim 37   , wherein said first layer comprises a photoresist.  
     
     
         41 . The apparatus according to    claim 38   , wherein said second layer comprises a photoresist.  
     
     
         42 . The apparatus according to    claim 39   , wherein said first and second layer comprise a photoresist.  
     
     
         43 . The apparatus according to    claim 37   , wherein said photoresist is a positive photoresist.  
     
     
         44 . The apparatus according to    claim 38   , wherein said photoresist is a positive photoresist.  
     
     
         45 . The apparatus according to    claim 38   , wherein said photoresist is a negative photoresist.  
     
     
         46 . The apparatus according to    claim 31   , wherein said photoresist comprises one of polyglutarimid and polybenzoxazol.  
     
     
         47 . The apparatus according to    claim 38   , wherein said photoresist comprises one of Novolak and Diaxochinon.  
     
     
         48 . The apparatus according to    claim 38   , wherein said photoresist comprises one of Novolak, Integrater, and Photoacid.  
     
     
         49 . The apparatus according to    claim 29   , further comprising; a second active organic layer on said substrate adjacent to at least one of said first layers; and 
 a second top electrode on a top surface area of said second active organic layer.    
     
     
         50 . The method according to    claim 49   , wherein said top surface area is maximized within an area having at least two borders defined by planes tangential to said at least two of said second layers.