Optimal trajectory robot motion

Abstract

An apparatus for processing wafers generally comprising a transfer chamber, a loadlock chamber mounted on the transfer chamber, one or more processing chambers mounted on the transfer chamber, a wafer handling member disposed in the transfer chamber, and a system controller programmed to move wafers through the transfer chamber following time optimal paths.

What is claimed is:  
     
         1 . An apparatus for transferring wafers, comprising: 
 (a) a wafer transfer chamber;    (b) a load lock chamber mounted on the wafer transfer chamber;    (c) a processing chamber mounted on the wafer transfer chamber;    (d) a robot comprising one or more wafer blades; and    (e) a system controller comprising program code for moving the wafer blade on a time optimal path through the transfer chamber.    
     
     
         2 . The apparatus of    claim 1    wherein the robot comprises a dual wafer blade.  
     
     
         3 . The apparatus of    claim 2    wherein the time optimal path comprises optimal velocities for an optimal path halfway between paths followed by wafers on the dual wafer blade.  
     
     
         4 . The apparatus of    claim 3    wherein the robot comprises a first and a second rotating member, an arm assembly connecting the first and second rotating members to the dual wafer blade, and first and second strut pivotally connected to the blade assembly.  
     
     
         5 . The apparatus of    claim 4    where the two arms of each assembly are pivotally connected.  
     
     
         6 . A process for transferring wafers between chambers, comprising the steps of: 
 (a) connecting a load lock chamber containing wafers to a wafer transfer chamber which comprises a robot and supports a wafer processing chamber; and    (b) transferring a wafer through the transfer chamber on a time optimal path.    
     
     
         7 . The process of    claim 6    wherein the load lock chamber and the processing chamber are mounted 180 apart on the transfer chamber.  
     
     
         8 . The process of    claim 6    wherein the load lock chamber and the processing chamber are mounted 90 apart on the transfer chamber.  
     
     
         9 . The process of    claim 6    wherein the robot comprises a dual wafer blade.  
     
     
         10 . The process of    claim 9    wherein the time optimal path comprises optimal velocities for an optimal path halfway between paths followed by wafers on the dual wafer blade.  
     
     
         11 . An apparatus for transferring wafers, comprising: 
 (a) a first rotating member;    (b) a second rotating member;    (c) a blade assembly having at least first and second wafer blades wherein the wafer blades are co-planar;    (d) an arm assembly connecting the first and second rotating members to the blade assembly; and    (e) a system controller comprising program code for moving the wafer blade assembly on a time optimal path.    
     
     
         12 . The apparatus of    claim 11    further comprising a first actuating member to rotate the first rotating member and a second actuating member to rotate the second rotating member.  
     
     
         13 . The apparatus of    claim 12    wherein the first and second actuating members are magnetically coupled to the first and second rotating members.  
     
     
         14 . The apparatus of    claim 13    wherein the arm assembly comprises two arms each having a first and a second strut pivotally connected to the blade assembly.  
     
     
         15 . The apparatus of    claim 14    where the two arms of each assembly are pivotally connected.  
     
     
         16 . The apparatus of    claim 15    wherein the time optimal path comprises optimal velocities for an optimal path halfway between paths followed by wafers on the first and second wafer blades.