Method of manufacturing a ceramic package utilizing green sheets

Abstract

In a semiconductor device, a ceramic package having a first surface and a second surface and having a recession section provided on the first surface side is provided. The recession section has a first opening provided at a center portion of the recession section and penetrating to the second surface, and pads provided in a peripheral portion of the second opening on the first surface side of the recession section. A semiconductor element mounted on a mount substrate is inserted in the first opening from the second surface side of the ceramic package. The semiconductor element is smaller than the mount substrate and has pads in a peripheral portion of the semiconductor element. The pads on the recession section and the pads on the semiconductor element are connected by electrically conductive wires.

What is claimed is:  
     
         1 . A semiconductor device, comprising: 
 a ceramic package having a first surface and a second surface and having a recession section provided on said first surface side, wherein said recession section has an opening provided at a center portion of said recession section and penetrating to said second surface, and pads provided in a peripheral portion of said opening on said first surface side of said recession section;    a semiconductor element section mounted on said second surface of said ceramic package, wherein said semiconductor element section has a mount substrate and a semiconductor element smaller than said mount substrate, fixed to under said substrate and fit in said opening from said second surface side of said ceramic package, and wherein said semiconductor element has pads in a peripheral portion of said semiconductor element; and    wires for connecting the pads on said recession section and the pads on said semiconductor element.    
     
     
         2 . A semiconductor device according to    claim 1   , wherein said ceramic package includes: 
 a first ceramic plate having said opening and said pads connected to a wiring pattern formed on said first surface side; and    a second ceramic plate having another opening larger than said opening at the center portion and adhered to said first ceramic plate on said first surface side.    
     
     
         3 . A semiconductor device according to    claim 1   , wherein said mount substrate is made of electrically conductive material.  
     
     
         4 . A semiconductor device according to    claim 3   , wherein said semiconductor element is mounted under said mount substrate with electrically conductive material and said semiconductor element section is adhered to said ceramic package on said second surface side with electrically conductive material.  
     
     
         5 . A semiconductor device according to    claim 1   , wherein said mount substrate is made of thermally conductive material.  
     
     
         6 . A semiconductor device according to    claim 5   , wherein said mount substrate has a surface area on a side opposite to said semiconductor element lager than that on a side of said semiconductor element.  
     
     
         7 . A ceramic package for a semiconductor device, comprising: 
 a first ceramic plate having a first opening provided to penetrate said first ceramic plate and a wiring pattern formed on a first surface side of said ceramic package; and    a second ceramic plate adhered to said first ceramic plate on said first surface side, wherein said second ceramic plate has a second opening larger than said first opening and provided concentrically with said first opening.    
     
     
         8 . A ceramic package according to    claim 7   , wherein a semiconductor element mounted on a mount substrate is inserted in said first opening, and said first opening has a size fit to said semiconductor element.  
     
     
         9 . A ceramic package according to    claim 7   , wherein a semiconductor element mounted on a mount substrate is inserted in said first opening, and said first opening has a predetermined size regardless of said semiconductor element.  
     
     
         10 . A method of manufacturing a semiconductor device, comprising the steps of: 
 providing a ceramic package having a first surface and a second surface and having a recession section provided on said first surface side, wherein said recession section has a first opening provided at a center portion of said recession section and penetrating to said second surface, and pads provided in a peripheral portion of said second opening on said first surface side of said recession section;    inserting a semiconductor element mounted on a mount substrate in said first opening from said second surface side of said ceramic package, wherein said semiconductor element is smaller than said mount substrate and has pads in a peripheral portion of said semiconductor element; and    connecting between the pads on said recession section and the pads on said semiconductor element by electrically conductive wires.    
     
     
         11 . A method according to    claim 10   , wherein said step of providing a ceramic package includes: 
 providing a first green sheet having said pads connected to a wiring pattern formed on said first surface side;    adhering a second green sheet having a second opening larger than said first opening at the center portion to said first green sheet on said first surface side;    baking said adhered green sheets to form said ceramic package; and    forming said first opening.    
     
     
         12 . A method according to    claim 11   , wherein said first opening has a size fit to said semiconductor element.  
     
     
         13 . A method according to    claim 11   , wherein said first opening has a predetermined size regardless of said semiconductor element.  
     
     
         14 . A method according to    claim 10   , wherein said step of providing a ceramic package includes: 
 providing a first green sheet having said first opening and said pads connected to a wiring pattern formed on said first surface side;    adhering a second green sheet having a second opening larger than said first opening at the center portion to said first green sheet on said first surface side; and    baking said adhered green sheets to form said ceramic package.    
     
     
         15 . A method according to    claim 14   , wherein said first opening has a size fit to said semiconductor element.  
     
     
         16 . A method according to    claim 14   , wherein said first opening has a predetermined size regardless of said semiconductor element.  
     
     
         17 . A method according to    claim 10   , wherein said mount substrate is made of electrically conductive material, and wherein said method further comprises the steps of: 
 adhering said semiconductor element to said mount substrate with electrically conductive material; and    adhering said semiconductor element section to said ceramic package on said second surface side with electrically conductive material.    
     
     
         18 . A method according to    claim 17   , further including providing said mount substrate made of thermally conductive material and having a surface area on a side opposite to said semiconductor element lager than that on a side of said semiconductor element.