US2001013629A1PendingUtilityA1
Multi-layer gate dielectric
Priority: Jun 30, 1998Filed: Jun 30, 1998Published: Aug 16, 2001
Est. expiryJun 30, 2018(expired)· nominal 20-yr term from priority
Inventors:Gang Bai
H10D 64/01342H10D 84/83H10D 64/691H10D 64/681H10D 30/60H10D 64/685
31
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Claims
Abstract
A transistor gate dielectric including a first dielectric material having a first dielectric constant and a second dielectric material having a second dielectric constant different from the first dielectric constant.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . A transistor gate dielectric comprising:
a first dielectric material having a first dielectric constant; and a second dielectric material having a second dielectric constant different from the first dielectric constant.
2 . The transistor gate dielectric of claim 1 , wherein the second dielectric constant is greater than the first dielectric constant.
3 . The transistor gate dielectric of claim 1 , wherein the first material has a first thickness and the second material has a second thickness, the combination of the first thickness and the second thickness defining a total thickness less than one- third of the length of a transistor gate adapted to overly the gate dielectric.
4 . The gate dielectric of claim 3 , wherein the first material thickness and the second material thickness are determined by the relationship
t
1
/k
1
+t
2
/k
2
=t
ox
/k
ox
wherein
t 1 is the first material thickness,
t 2 is the second material thickness,
t ox is the minimum thickness for a gate dielectric of silicon dioxide for a chosen gate length,
k 1 is the dielectric constant for the first dielectric material,
k 2 is the dielectric constant for the second dielectric material, and
k ox is the dielectric constant of silicon dioxide.
5 . The gate dielectric of claim 1 , wherein the first gate dielectric material is selected from one of silicon nitride, HfO 2 , BaO, La 2 O 3 , Y 2 O 3 , and ZrO 2 .
6 . The gate dielectric of claim 1 , wherein the second dielectric material is selected from one of BST and PZT.
7 . The gate dielectric of claim 1 , further comprising a third dielectric material having a third dielectric constant.
8 . A transistor having a gate electrode overlying a gate dielectric comprising:
a first dielectric material having a first dielectric constant; and a second dielectric material having a second dielectric constant different from the first dielectric constant.
9 . The transistor of claim 8 , wherein the second dielectric of the gate dielectric has a dielectric constant greater than the first dielectric constant.
10 . The transistor of claim 8 , wherein the first material of the gate dielectric has a first thickness and the second material of the gate dielectric has a second thickness, the combination of the first thickness and the second thickness defining a total thickness less than one-third of a length of the transistor gate electrode.
11 . The transistor of claim 8 , wherein the first material thickness and the second material thickness are determined by the relationship
t
1
/k
1
+t
2
/k
2
=t
ox
/k
ox
wherein
t 1 is the first material thickness,
t 2 is the second material thickness,
t ox is the minimum thickness for a gate dielectric of silicon dioxide for a chosen gate electrode length,
k 1 is the dielectric constant for the first dielectric material,
k 2 is the dielectric constant for the second dielectric material, and
k ox is the dielectric constant of silicon dioxide.
12 . The transistor of claim 8 , wherein the first gate dielectric material is selected from one of silicon nitride, HfO 2 ,BaO, La 2 O 3 , Y 2 O 3 , and ZrO 2 .
13 . The gate dielectric of claim 8 , wherein the second dielectric material is selected from one of BST and PZT.
14 . The gate dielectric of claim 8 , further comprising a third dielectric material having a third dielectric constant.Join the waitlist — get patent alerts
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