Manufacturing method of electronic component, manufacturing apparatus thereof, and driving method of manufacturing apparatus thereof

Abstract

In manufacturing an electronic component composed of a plastic molded part having a built-in electronic element, and leads projecting from the plastic molded part, a first partial lead section, between an intermediate section and a tip section, of each lead of the electronic component is bent downward. The first section of each lead is bent from the side toward a bottom of the plastic molded part after further bending a base of each lead.

What is claimed is:  
     
         1 . A method for manufacturing an electronic component that includes a plastic molded part containing a built-in electronic element, and leads projecting from the plastic molded part, comprising: 
 bending a first section of each lead to form a first bent section in each lead;    bending each lead near its base; and    further bending each lead near its base by horizontally pressing each lead from a side of the molded part.    
     
     
         2 . The manufacturing method according to    claim 1   , wherein the step of bending the first section comprises forming the first bent section in each lead between a tip section and a middle section of each lead.  
     
     
         3 . The manufacturing method according to    claim 1   , wherein the step of bending the first section comprises a plurality of bending sub-steps.  
     
     
         4 . The manufacturing method according to    claim 1   , wherein the electronic component comprises a quartz resonator.  
     
     
         5 . An apparatus for manufacturing an electronic component having leads, comprising: 
 an upper mold and a lower mold;    the upper mold comprising a cam driver; and    the lower mold comprising a cam that is moved horizontally by the cam driver to bend each lead.    
     
     
         6 . The apparatus according to    claim 5   , further comprising a bending die and a resilient member that separates the cam from the die to form a gap therebetween.  
     
     
         7 . The apparatus according to    claim 5   , further comprising a flat roller on which the cam slides in a horizontal direction.  
     
     
         8 . An apparatus for manufacturing an electronic component that includes a plastic molded part containing a built-in electronic element, and leads projecting from the plastic molded part, comprising: 
 a first bending punch that bends a first section of each lead to form a first bent section, and a first bending die corresponding to the first bending punch;    a second bending punch that bends each lead near its base, and a second bending die corresponding to the second bending punch;    a third bending punch; and    a cam driver that drives the third bending punch in a horizontal direction to further bend each lead near its base .    
     
     
         9 . The apparatus according to    claim 8   , further comprising: 
 a fourth bending punch that further bends the first bent section; and    a third bending die corresponding to the fourth bending punch.    
     
     
         10 . The apparatus according to    claim 9   , wherein each end section of the first, second, and fourth bending punches each comprise an end section including a curved face.  
     
     
         11 . The apparatus according to    claim 8   , further comprising through-holes formed around each of the first, second, and third bending dies to pass punched chips of the leads.  
     
     
         12 . The apparatus according to    claim 8   , wherein at least a part of the first bending die approaches each lead near its base during bending.  
     
     
         13 . The apparatus according to    claim 8   , wherein each of the first, second, and third bending punches, each of the first and second bending dies, and the cam driver are formed so as to bend leads formed along a major axis of the electronic component.  
     
     
         14 . The apparatus according to    claim 8   , wherein each of the first, second, and third bending punches, each of the first and second bending dies, and the cam driver are formed so as to bend leads formed along a minor axis of the electronic component.  
     
     
         15 . A method for driving apparatus for manufacturing an electronic component that includes a plastic molded part containing a built-in electronic element, and leads projecting from the plastic molded part, comprising: 
 driving a first bending punch to bend a first section of each lead;    driving a second bending punch to bend each lead near its base; and    driving a cam driver to further bend each lead near its base.    
     
     
         16 . The driving method according to    claim 15   , wherein the step of driving a cam driver comprises driving a third bending punch horizontally with the cam driver.