Aluminum or aluminum alloy sputtering target and method for manufacturing the same

Abstract

The sputtering target is manufactured by adjusting the ratio of the gas flow volume (Nm 3 )/molten liquid flow mass (kg) to 5 Nm 3 /kg or more in the gas atomizing step of the spray forming method using an Al or Al alloy sputtering target material in which the maximum length of all the inclusions is 20 μm or less.

What is claimed is:  
     
         1 . A method for manufacturing an aluminum or aluminum alloy sputtering target material comprising aluminum or aluminum alloy containing inclusions having a maximum length of 20 μm, wherein the ratio of the gas volume (Nm 3 )/the liquid mass (kg) is 5 Nm 3 /kg or more in a spray forming method including the step of obtaining an aluminum or aluminum alloy ingot by a gas atomizing step of a molten liquid having aluminum or aluminum alloy.  
     
     
         2 . A method for manufacturing an aluminum or aluminum alloy sputtering target material according to    claim 1   , wherein the ratio of the gas volume (Nm 3 )/the liquid mass (kg) is adjusted to be 10 Nm 3 /kg or more.  
     
     
         3 . A method for manufacturing an aluminum or aluminum alloy sputtering target material according to    claim 2   , wherein nitrogen gas is used for atomizing gas in the gas atomizing step.  
     
     
         4 . A method for manufacturing an aluminum or aluminum alloy sputtering target material comprising aluminum or aluminum alloy containing inclusions having a maximum length of 20 μm comprises: 
 melting an material having aluminum or aluminum alloy ingot into a liquid flow;  
 atomizing a gas flow;  
 spraying the liquid flow onto a surface by means of said gas flow, wherein the ratio of the gas flow volume (Nm 3 )/the liquid flow mass (kg) is 5 Nm 3 /kg or more; and  
 depositing on said surface an aluminum or aluminum alloy sputtering target material comprising aluminum or aluminum alloy containing inclusions having a maximum length of 20 μm.  
 
     
     
         5 . A method for manufacturing an aluminum or aluminum alloy sputtering target material according to    claim 4   , wherein the ratio of the gas flow volume (Nm 3 )/the liquid flow mass (kg) is adjusted to be 10 Nm 3 /kg or more.  
     
     
         6 . A method for manufacturing an aluminum or aluminum alloy sputtering target material according to    claim 5   , wherein nitrogen gas is used for the gas flow.  
     
     
         7 . A method for manufacturing an aluminum or aluminum alloy sputtering target material comprising aluminum or aluminum alloy containing inclusions having a maximum length of 10 μm comprises: 
 melting an material having aluminum or aluminum alloy ingot into a liquid flow;  
 atomizing a gas flow;  
 spraying the liquid flow onto a surface by means of said gas flow, wherein the ratio of the gas flow volume (Nm 3 )/the liquid flow mass (kg) is 5 Nm 3 /kg or more; and  
 depositing on said surface an aluminum or aluminum alloy sputtering target material comprising aluminum or aluminum alloy containing inclusions having a maximum length of 10 μm.  
 
     
     
         8 . A method for manufacturing an aluminum or aluminum alloy sputtering target material according to    claim 7   , wherein the ratio of the gas flow volume (Nm 3 )/the liquid flow mass (kg) is adjusted to be 10 Nm 3 /kg or more.  
     
     
         9 . A method for manufacturing an aluminum or aluminum alloy sputtering target material according to    claim 8   , wherein nitrogen gas is used for the gas flow.