US2001003579A1PendingUtilityA1
Process for the reduction of copper oxide
Priority: Jun 27, 1996Filed: May 11, 1998Published: Jun 14, 2001
Est. expiryJun 27, 2016(expired)· nominal 20-yr term from priority
C23C 22/63C01G 3/02H05K 3/385C23C 22/83H05K 2203/0315H05K 2203/1157C01P 2006/60H05K 3/38
24
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Claims
Abstract
The present invention provides a method of reducing copper oxide to improve its acid resistance comprising the step of reacting cupric oxide with a reducing agent selected from the group consisting of morpholine borane, ethylene diamine borane, ethylene diamine bisborane, t-butylamine borane, piperazine borane, imidazole borane, and methoxyethylamine borane to form cuprous oxide.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of reducing copper oxide comprising the step of reacting the copper oxide with a reducing agent selected from the group consisting of morpholine borane, ethylene diamine borane, ethylene diamine bisborane, t-butylamine borane, piperazine borane, imidazole borane, and methoxyethylamine borane.
2 . The method of claim 1 wherein the reaction occurs in a solution of the reducing agent wherein the concentration of the reducing agent is in the range of approximately 0.1 wt % to the solubility limit of the reducing agent.
3 . The method of claim 2 wherein the concentration of the reducing agent is in the range of approximately 0.3 wt % to the solubility limit of the reducing agent.
4 . The method of claim 1 wherein the reaction occurs at temperature in the range of approximately 3° C. to approximately 95° C.
5 . The method of claim 4 wherein the reaction occurs at temperature in the range of approximately 20° C. to approximately 50° C.
6 . The method of claim 1 wherein the solvent comprises water and the pH of the solution is in the range of approximately 4 to approximately 14.
7 . The method of claim 6 wherein the pH of the solution is in the range of approximately 5 to approximately 13.
8 . The method of claim 7 wherein the pH of the solution is in the range of approximately 7 to approximately 13.
9 . The method of claim 2 wherein reducing agent is morpholine borane.
10 . The method of claim 9 wherein concentration of the morpholine borane is in the range of approximately 0.1 wt % to 2.0 wt %.
11 . A method of reducing cupric oxide to cuprous oxide comprising the step of reacting the copper oxide with a reducing agent selected from the group consisting of morpholine borane, ethylene diamine borane, ethylene diamine bisborane, t-butylamine borane, piperazine borane, imidazole borane, and methoxyethylamine borane.
12 . The method of claim 11 wherein the reaction occurs in a solution of the reducing agent wherein the concentration of the reducing agent is in the range of approximately 0.1 wt % to the solubility limit of the reducing agent.
13 . The method of claim 12 wherein the concentration of the reducing agent is in the range of approximately 0.3 wt % to the solubility limit of the reducing agent.
14 . The method of claim 11 wherein the reaction occurs at temperature in the range of approximately 3° C. to approximately 95° C.
15 . The method of claim 14 wherein the reaction occurs at temperature in the range of approximately 20° C. to approximately 50° C.
16 . The method of claim 11 wherein the solvent comprises water and the pH of the solution is in the range of approximately 4 to approximately 14.
17 . The method of claim 16 wherein the pH of the solution is in the range of approximately 5 to approximately 13.
18 . The method of claim 17 wherein the pH of the solution is in the range of approximately 7 to approximately 13.
19 . The method of claim 12 wherein reducing agent is morpholine borane.
20 . The method of claim 19 wherein concentration of the morpholine borane is in the range of approximately 0.1 wt % to 2.0 wt %.Join the waitlist — get patent alerts
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