US2001001978A1PendingUtilityA1

Electronic apparatus, manufacturing method therefor, and mold device

Assignee: TOSHIBA KKPriority: Jun 19, 1998Filed: Dec 18, 2000Published: May 31, 2001
Est. expiryJun 19, 2018(expired)· nominal 20-yr term from priority
B22D 17/2236
39
PatentIndex Score
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Cited by
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Claims

Abstract

An electronic apparatus such as a portable computer comprises an electronic apparatus frame and a raised portion provided on that region of the electronic apparatus frame which engages an ejector pin projecting from inside a mold device and formed thicker than the other part of the electronic apparatus frame.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . An electronic apparatus comprising: 
 a frame; and    a raised portion provided on that region of said frame which engages an ejector pin projecting from inside a mold device and formed thicker than the peripheral portion of said engaging region at the least.    
     
     
         2 . An electronic apparatus according to    claim 1   , wherein said raised portion is surrounded by ribs for reinforcement.  
     
     
         3 . An electronic apparatus comprising: 
 a frame; and    a protrusion provided on that region of said frame which engages an ejector pin projecting from inside a mold device and formed projecting from the peripheral portion of said engaging region at the least.    
     
     
         4 . In a mold device including a first mold and a second mold for forming a frame of a metallic material and having an ejector pin adapted to push out a molded piece from the first mold after the molded piece is formed, 
 a depression being formed in that part of said first mold from which the ejector pin projects so that the part pushed out by means of the ejector pin forms a raised portion.    
     
     
         5 . A mold device according to    claim 4   , wherein said depression is surrounded by grooves for forming ribs for reinforcement.  
     
     
         6 . A method of manufacturing an electronic apparatus, comprising the steps of: 
 introducing molten metal into a mold having a first mold section and a second mold section, said first mold section has a recess so that a molding has a thick-wall part that may contact an ejector pin;    solidifying the molten metal in the mold, thereby to form a molding; and    pushing the thick-wall part of the molding with the ejector pin, thereby to take the molding from the mold.

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