Enhanced arrangement for supplying power to a circuit board

Abstract

An electrical interface arrangement includes a buss bar having a longitudinal edge that is substantially smooth and free of conductive tabs. A conductive member is arranged adjacent to the longitudinal edge of the buss bar, and contacts the buss bar with at least 40 A-spots per inch, along substantially an entire length of the buss bar. A circuit board having a plurality of internal planes is provided, with at least one of the internal planes being an internal power plane, and with at least another one of the internal planes being an internal wiring plane having a plurality of conductive wirings. The circuit board further has an arrangement for electrically connecting the conductive member to the internal power plane without interfering with a placement of the conductive wirings, so that the circuit board and the buss bar are in electrical communication.

What is claimed is:  
     
         1 . A circuit board, comprising: 
 at least two insulating layers;    at least one layer having a plurality of conductive wirings located in a first common plane and being superposed between said two insulating layers; and    at least one layer having a conductive sheet located in a second common plane that is essentially parallel to the first common plane, and being separated from said layer of conductive wirings by one of said two insulating layers; and    means for electrically connecting said conductive sheet to a power source without interfering with a placement of any of said conductive wirings.    
     
     
         2 . The circuit board of    claim 1   , wherein said means comprises a plurality of conductive vias formed in at least said one of said two insulating layers, and being positioned to avoid, and in dependence on a predetermined location of, said conductive wirings.  
     
     
         3 . The circuit board of    claim 2   , wherein said means further comprises a conductive pad connectable to the power source and being located over another one of said two insulating layers; said conductive vias being formed in both of said two insulating layers, and electrically coupling said conductive sheet to said conductive pad.  
     
     
         4 . The circuit board of    claim 3   , wherein at least some of said conductive vias are located between respective ones of said conductive wirings.  
     
     
         5 . A method of connecting a circuit board to a power source, comprising: 
 forming a circuit board by: 
 providing a plurality of conductive wirings in a first common plane and superposed between two insulating layers;  
 providing a conductive layer located in a second common plane that is essentially parallel to the first common plane, and being separated from the layer of conductive wirings by one of the two insulating layers; and  
 forming a plurality of conductive vias, each extending through the two insulating layers and being located between respective adjacent ones of the conductive wirings, without interfering with a placement of the conductive wirings, each of the conductive vias being in electrical communication with the conductive layer; and  
   electrically coupling the conductive vias to a power source.    
     
     
         6 . The method of    claim 5   , wherein said providing a plurality of conductive wirings includes positioning the conductive wirings independent of a placement of the conductive vias.  
     
     
         7 . The method of    claim 6   , wherein said providing a plurality of conductive wirings includes arranging the conductive wirings to be essentially parallel to each other, with each conductive wiring being separated from an adjacent conductive wiring by a space.  
     
     
         8 . The method of    claim 7   , wherein said forming a plurality of conductive vias includes locating the conductive vias in the respective spaces.  
     
     
         9 . The method of    claim 5   , wherein said electrically coupling includes: 
 providing a conductive pad on a surface of the circuit board and in electrical communication with the conductive vias;    providing a buss bar having at least one conductive channel formed along a lower longitudinal edge thereof;    positioning a coil spring within the channel;    connecting the buss bar to the circuit board so that an open side of the channel faces the circuit board, and so that the spring is positioned over, and in contact with, the conductive pad; and    connecting the buss bar to the power source.    
     
     
         10 . The method of    claim 9   , wherein said positioning a coil spring includes providing the coil spring with an outer diameter that is greater than a width of the channel, so that a portion of the spring bulges out of the open side of the channel.  
     
     
         11 . The method of    claim 5   , wherein said electrically coupling includes: 
 providing a conductive pad on a surface of the circuit board and in electrical communication with the conductive vias;    providing a plate having an elongated through opening therein;    providing a buss bar;    laying an elongated conductive coil spring within the opening;    securing the plate to a base of the buss bar, so that a side of the spring engages the buss bar, and an opposite side of the spring projects out of the opening;    connecting the buss bar and plate to the circuit board so that the spring is positioned over, and in contact with, the conductive pad; and    connecting the buss bar to the power source.