Single switch direct cooling assemblies and related methods

Abstract

Implementations of a dual sided cooling module may include a high side module coupled over a low side module through a coupling heat sink at a first largest planar surface of the high side module and at a first largest planar surface of the low side module; a high side heat sink coupled at a second largest planar surface of the high side module; and a low side heat sink coupled at a second largest planar surface of the low side module. A single cooling fluid may contact the coupling heat sink, the high side heat sink, and the low side heat sink.

What is claimed is: 
     
         1 . A cooling assembly comprising:
 at least two single switch modules coupled into corresponding openings in a support frame;   an upper jacket coupled to the support frame;   a lower jacket coupled to the support frame;   a coolant inlet coupled with the support frame; and   a coolant outlet coupled with the support frame;   wherein each of the at least two single switch modules comprises a high side module directly mechanically coupled over a low side module through a coupling heat sink at a first largest planar surface of the high side module and at a first largest planar surface of the low side module.   
     
     
         2 . The assembly of  claim 1 , wherein the support frame comprises at least two flow pathways therein configured to direct cooling fluid to the coupling heat sink of each of the at least two single switch modules. 
     
     
         3 . The assembly of  claim 1 , wherein the lower jacket and the upper jacket are coupled over the at least two single switch modules. 
     
     
         4 . The assembly of  claim 1 , wherein the assembly is an immersion cooling module. 
     
     
         5 . The assembly of  claim 1 , wherein the at least two single switch modules are configured to be single side cooled by a coolant passing from the coolant inlet to the coolant outlet. 
     
     
         6 . The assembly of  claim 1 , wherein the at least two single switch modules are configured to be dual side cooled by a coolant passing from the coolant inlet to the coolant outlet. 
     
     
         7 . The assembly of  claim 1 , wherein the high side module and the low side module are thermally coupled only through the coupling heat sink. 
     
     
         8 . The assembly of  claim 1 , further comprising:
 a high side heat sink coupled at a second largest planar surface of the high side module; and   a low side heat sink coupled at a second largest planar surface of the low side module;   wherein a single cooling fluid contacts the coupling heat sink, the high side heat sink, and the low side heat sink.