Thermoelectric device

Abstract

A thermoelectric device according to an embodiment of the present invention includes: a duct; a first thermoelectric module disposed on the duct and including a thermoelectric element; and a shield member disposed on the first thermoelectric module, wherein the first thermoelectric module includes: a first substrate; a first electrode part disposed on the first substrate; a semiconductor element part disposed on the first electrode part; a second electrode part disposed on the semiconductor element part; a second substrate disposed on the second electrode part; and a second terminal electrode and a first terminal electrode arranged in an area on the first substrate in which the first electrode part is not disposed, and the shield member includes a first protruding part protruding toward the first substrate in a corresponding area between the first terminal electrode and the second terminal electrode.

The invention claimed is: 
     
         1 . A thermoelectric device comprising:
 a duct;   a first thermoelectric module disposed on the duct and including a thermoelectric element;   a shield member disposed on the first thermoelectric module; and   a bonding layer,   wherein the first thermoelectric module includes:
 a first substrate; 
 a first electrode part disposed on the first substrate; 
 a semiconductor element part disposed on the first electrode part; 
 a second electrode part disposed on the semiconductor element part; 
 a second substrate disposed on the second electrode part; and 
 a first terminal electrode and a second terminal electrode that are disposed on an area of the first substrate in which the first electrode part is not disposed, 
   wherein an inner surface of the shield member includes a first concave part disposed on the first terminal electrode, a second concave part disposed on the second terminal electrode, and a first protruding part protruding toward the first substrate between the first concave part and the second concave part,   wherein the bonding layer bonds the first protruding part and the first substrate between the first terminal electrode and the second terminal electrode, and   wherein a height of bonding layer in a direction perpendicular to the first substrate is greater than a height of the first terminal electrode or the second terminal electrode.   
     
     
         2 . The thermoelectric device of  claim 1 , wherein the bonding layer includes at least one of an epoxy resin and a silicon resin. 
     
     
         3 . The thermoelectric device of  claim 1 , wherein a distance between the first substrate and the shield member in a direction perpendicular to the first substrate in an area in which the first electrode part is disposed is greater than that in the area corresponding to an area between the first terminal electrode and the second terminal electrode. 
     
     
         4 . The thermoelectric device of  claim 1 , wherein polarities of the first terminal electrode and the second terminal electrode are different from each other. 
     
     
         5 . The thermoelectric device of  claim 1 , further comprising a second thermoelectric module disposed adjacent to the first thermoelectric module and including a third terminal electrode and a fourth terminal electrode,
 wherein the shield member is disposed on the second thermoelectric module, and   the shield member includes a second protruding part protruding from an area corresponding to an area between the first thermoelectric module and the second thermoelectric module.   
     
     
         6 . The thermoelectric device of  claim 5 , wherein the second protruding part is disposed on an electrical wire connecting the first thermoelectric module with the second thermoelectric module. 
     
     
         7 . The thermoelectric device of  claim 1 , wherein
 the first thermoelectric module further includes a first connector disposed on the first terminal electrode and a second connector disposed on the second terminal electrode, and   the first concave part and the second concave part are spaced apart from the first connector and the second connector.   
     
     
         8 . The thermoelectric device of  claim 7 , wherein an insulating layer is disposed on the first concave part and the second concave part. 
     
     
         9 . The thermoelectric device of  claim 8 , wherein the insulating layer includes at least one of an epoxy resin and a silicon resin. 
     
     
         10 . The thermoelectric device of  claim 1 , wherein the first thermoelectric module further includes a first connector disposed on the first terminal electrode and a second connector disposed on the second terminal electrode, and further includes a first layer disposed on each of the first connector and the second connector and a second layer having a material different from that of the first layer and disposed on the first layer. 
     
     
         11 . The thermoelectric device of  claim 10 , wherein one of the first layer and the second layer includes an epoxy resin, and the other of the first layer and the second layer includes a silicon resin. 
     
     
         12 . The thermoelectric device of  claim 1 , wherein the first thermoelectric module further includes a first connector disposed on the first terminal electrode and a second connector disposed on the second terminal electrode, and further includes a layer molding on each of the first connector and the second connector. 
     
     
         13 . The thermoelectric device of  claim 1 , wherein the first thermoelectric module further includes a heat sink disposed on the thermoelectric element. 
     
     
         14 . The thermoelectric device of  claim 1 , wherein the shield member is made of an insulating material.