Metal clip applied to power module

Abstract

A metal clip disposed on chips to connect the chips to each other, includes a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and an outer side part formed at each of the bonding parts to extend upward from at least a portion of an outer side of respective ones of the bonding parts to form a step therefrom.

What is claimed is: 
     
         1 . A metal clip disposed on chips to connect the chips to each other, comprising:
 a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and   an outer side part formed at each of the bonding parts to extend upward from an outermost edge portion of a respective one of the bonding parts such that a step is formed at the outermost part of the bonding part,   wherein a lower portion of the outer side part includes a recessed s ace of cut-out formed therein.   
     
     
         2 . The metal clip of  claim 1 , further comprising a pressing groove recessed inward along a boundary between an upper surface of each of the bonding parts and the outer side part, on the upper surface of each of the bonding parts. 
     
     
         3 . The metal clip of  claim 2 , wherein the pressing groove of each of the bonding parts is formed by pressing an upper surface of a region in which the pressing groove of each of the bonding parts is formed. 
     
     
         4 . The metal clip of  claim 2 , wherein the lower surface of each of the bonding parts is flat. 
     
     
         5 . The metal clip of  claim 1 , wherein a thickness of the bonding part and a thickness of the outer side part are the same. 
     
     
         6 . The metal clip of  claim 1 , wherein the outer side part is bent at a predetermined angle from the bonding part to extend upward. 
     
     
         7 . The metal clip of  claim 6 , wherein an angle between a lower surface of the outer side part and the lower surface of the bonding part is less than a right angle. 
     
     
         8 . The metal clip of  claim 1 , wherein the outer side part at each of the bonding parts is symmetrical to another outer side part respective to a center of a corresponding one of the bonding parts. 
     
     
         9 . The metal clip of  claim 1 , wherein each of the bonding parts has a rectangular shape when viewed from above, and
 the outer side part at each of the bonding parts is formed at edges of respective ones of the bonding parts in three of four directions or in all the four directions.   
     
     
         10 . The metal clip of  claim 1 , wherein one or more through holes penetrating through a connection part connecting two adjacent bonding parts of the plurality of bonding parts are formed in the connection part. 
     
     
         11 . The metal clip of  claim 10 , wherein at least one of the one or more through holes is formed in an elliptical shape. 
     
     
         12 . The metal clip of  claim 1 , further comprising a thermal interface material disposed within an internal cavity of at least one of the bonding parts, the thermal interface material being configured to enhance heat transfer from the bonding part to an external heat sink. 
     
     
         13 . A metal clip disposed on chips to connect the chips to each other, comprising:
 a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and   an outer side part formed at each of the bonding parts to extend upward from an outermost edge portion of a respective one of the bonding parts such that a step is formed at the outermost part of the bonding part,   wherein one or more through holes penetrating through a connection part connecting two adjacent bonding parts of the plurality of bonding parts are formed in the connection part.