High speed powder coating line for heat sensitive substrates

Abstract

A system for applying a powder coating to a heat-sensitive substrate that may include at least one radiative oven, at least one convective oven, and a powder application system. The powder application system may include a plurality of powder application devices configured to apply powder to at least a top surface of the heat sensitive substrate while the heat sensitive substrate is oriented in a horizontal orientation.

The invention claimed is: 
     
         1 . A system for applying a powder coating to a heat-sensitive substrate, the system comprising:
 at least one radiative oven;   at least one convective oven;   a powder application system including a plurality of powder application devices configured to apply powder to at least a top surface of the heat sensitive substrate while the heat sensitive substrate is oriented in a horizontal orientation; and   a conveyance system that allows for conveyance speeds of more than 50 feet per minute, and wherein the at least one radiative oven preheats the heat sensitive substrate for no more than 30 seconds.   
     
     
         2 . The system of  claim 1 , wherein the at least one radiative oven is positioned prior to the powder application device and is configured to preheat the heat sensitive substrate prior to the application of the powder. 
     
     
         3 . The system of  claim 1 , wherein the at least one radiative oven preheats the heat-sensitive substrate with infrared radiation. 
     
     
         4 . The system of  claim 1 , wherein the at least one radiative oven comprises a first radiative oven and a second radiative oven, the first radiative oven positioned prior to the powder application system and the second radiative oven positioned after the powder application system. 
     
     
         5 . The system of  claim 4 , wherein the first radiative oven is configured to preheat the heat-sensitive substrate prior to the application of the powder, and the second radiative oven is configured to heat the heat-sensitive substrate to a curing temperature after the application of the powder. 
     
     
         6 . The system of  claim 1 , wherein the at least one convective oven is positioned prior to the powder application device, and is configured to heat the heat sensitive substrate prior to the application of the powder. 
     
     
         7 . The system of  claim 1 , wherein the at least one convective oven comprises a first convective oven and a second convective oven, the first convective oven positioned prior to the powder application system and the second convective oven positioned after the powder application system. 
     
     
         8 . The system of  claim 7 , wherein the first convective oven is configured to heat the heat-sensitive substrate to a powder coating temperature prior to the application of the powder, and the second convective oven is configured to heat the heat-sensitive substrate to a curing temperature after the application of the powder.