US12451406B2ActiveUtilityA1
Silicon nitride substrate and method of manufacturing the same
Est. expiryFeb 25, 2042(~15.6 yrs left)· nominal 20-yr term from priority
H10W 99/00H10W 90/00H10W 40/259H10W 40/255H10W 70/692H02P 27/06C04B 2235/9661C04B 2235/9607C04B 2235/6562C04B 2235/9623C04B 2235/95C04B 2235/6025C04B 2235/6021C04B 2235/3206C04B 2235/3224C04B 2235/46C04B 2235/428C04B 2235/723C04B 2235/721C04B 2235/5436C04B 2235/5409C04B 35/638C04B 35/63424C04B 35/6342C04B 35/6365C04B 35/6263C04B 35/6264C04B 35/591H01L 25/072H01L 21/4807H01L 23/3735
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References
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Claims
Abstract
Color unevenness generated on a surface of a silicon nitride substrate is reduced. A silicon nitride substrate formed by nitriding silicon containing in a sheet-shaped green body includes a first surface and a second surface opposite to the first surface. In this case, when color difference between a center and an edge of at least one surface of the first surface and the second surface is expressed to be “ΔE*ab”, a relation “ΔE*ab≤1.5” is established.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A silicon nitride substrate comprising:
a first surface; and
a second surface opposite to the first surface,
wherein a planar shape is rectangular, each side length of which is equal to or larger than 100 mm,
a thermal conductivity is equal to or higher than 110 W/(m·K),
when color difference between a center and an edge of at least one surface of the first surface and the second surface is expressed to be “ΔE*ab”, a relation “0<ΔE*ab≤1.5” is established at all edges positioned inward from each corner by 15 mm in a direction to the center.
2. The silicon nitride substrate according to claim 1 ,
wherein a relation “0<ΔE*ab≤0.8” is established.
3. The silicon nitride substrate according to claim 1 ,
wherein lightness at each of the center and the edge is equal to or higher than 70.
4. The silicon nitride substrate according to claim 1 ,
wherein chromaticness at each of the center and the edge is equal to or higher than 10.
5. A method of manufacturing a silicon nitride substrate comprising steps of:
(a) preparing a slurry containing silicon power;
(b) forming a green body from the slurry; and
(c) sintering the green body in a furnace,
wherein the step (c) includes a nitriding step of nitriding the green body by heating the green body at a predetermined heating temperature, and,
in the nitriding step, an average of a temperature rise amount per unit time in a range from 1270° C. to 1340° C. is equal to or lower than 3.1° C./h.
6. The silicon nitride substrate according to claim 2 ,
wherein lightness at each of the center and the edge is equal to or higher than 70.
7. The silicon nitride substrate according to claim 2 ,
wherein chromaticness at each of the center and the edge is equal to or higher than 10.
8. The silicon nitride substrate according to claim 3 ,
wherein chromaticness at each of the center and the edge is equal to or higher than 10.Join the waitlist — get patent alerts
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