Measuring device and measuring system

Abstract

A measuring device includes a substrate having a first surface and a second surface on an opposite side from the first surface, a first electrode and a second electrode provided on the substrate, a heat-sensitive portion, provided on the first surface, and configured to detect heat of a substance that makes contact with the first surface, a temperature sensor provided on the second surface, and a heat transfer member, penetrating the substrate, and configured to transfer heat of the heat-sensitive portion to the temperature sensor.

What is claimed is: 
     
       1. A measuring device comprising:
 a substrate having a first surface and a second surface on an opposite side from the first surface; 
 a first electrode and a second electrode provided on the substrate; 
 a heat-sensitive portion, provided on the first surface, and configured to detect heat of a substance that makes contact with the first surface; 
 a temperature sensor provided on the second surface; and 
 a heat transfer member, penetrating the substrate, and configured to transfer heat of the heat-sensitive portion to the temperature sensor, 
 wherein the heat-sensitive portion includes a first copper film. 
 
     
     
       2. The measuring device as claimed in  claim 1 , wherein the first electrode and the second electrode are used to detect a dielectric constant between the first electrode and the second electrode. 
     
     
       3. The measuring device as claimed in  claim 1 , wherein
 the heat-sensitive portion and the temperature sensor overlap each other in a plan view viewed in a direction perpendicular to the first surface, and 
 the heat transfer member includes a heat transfer via extending in the direction perpendicular to the first surface. 
 
     
     
       4. The measuring device as claimed in  claim 3 , wherein
 the heat transfer member includes a second copper film provided on the second surface and making contact with the heat transfer via, and 
 the temperature sensor makes contact with the second copper film. 
 
     
     
       5. The measuring device as claimed in  claim 1 , wherein the heat transfer member includes a second copper film making contact with the heat-sensitive portion. 
     
     
       6. The measuring device as claimed in  claim 1 , further comprising:
 a third electrode and a fourth electrode provided on the second surface; 
 a first buffer circuit electrically connected between the first electrode and the third electrode; and 
 a second buffer circuit electrically connected between the second electrode and the fourth electrode, 
 wherein the first electrode and the third electrode overlap each other, and the second electrode and the fourth electrode overlap each other, in a plan view viewed in a direction perpendicular to the first surface. 
 
     
     
       7. The measuring device as claimed in  claim 1 , wherein each of the first electrode and the second electrode has a planar shape that is approximately arcuate band-shaped. 
     
     
       8. The measuring device as claimed in  claim 1 , wherein the first electrode and the second electrode are electrically insulated from each other. 
     
     
       9. The measuring device as claimed in  claim 1 , further comprising:
 a plurality of spacers provided on the second surface, 
 wherein each of the plurality of spacers has a thickness greater than a thickness of the temperature sensor. 
 
     
     
       10. The measuring device as claimed in  claim 3 , wherein the heat transfer via includes
 a via hole penetrating the substrate, 
 a second copper film covering an inner wall surface of the via hole, and 
 a filler material filling an inner side of the second copper film. 
 
     
     
       11. A measuring system comprising:
 a measuring device including:
 a substrate having a first surface and a second surface on an opposite side from the first surface, 
 a first electrode and a second electrode provided on the substrate, 
 a heat-sensitive portion, provided on the first surface, and configured to detect heat of a substance that makes contact with the first surface, 
 a temperature sensor provided on the second surface, and 
 a heat transfer member, penetrating the substrate, and configured to transfer heat of the heat-sensitive portion to the temperature sensor; 
 
 a detection circuit configured to detect a dielectric constant between the first electrode and the second electrode; and 
 a processor configured to compute a physical property of a measuring object placed on the first surface, from an output signal of the temperature sensor and an output signal of the detection circuit. 
 
     
     
       12. The measuring system as claimed in  claim 11 , wherein the measuring object includes a container, and water sealed inside the container. 
     
     
       13. The measuring system as claimed in  claim 11 , wherein the heat-sensitive portion of the measuring device includes a copper film.