Stacked die package including a multi-contact interconnect

Abstract

The present disclosure is directed to a package that includes a plurality of die that are stacked on each other. The plurality of die are within a first resin and conductive layer is on the first resin. The conductive layer is coupled between ones of first conductive vias extending into the first resin to corresponding ones of the plurality of die. The conductive layer and the first conductive vias couple ones of the plurality of die to each other. A second conductive via extends into the first resin to a contact pad of the substrate, and the conductive layer is coupled to the second conductive via coupling ones of the plurality of die to the contact pad of the substrate. A second resin is on and covers the first resin and the conductive layer on the first resin. In some embodiments, the first resin includes a plurality of steps (e.g., a stepped structure). In some embodiments, the first resin includes inclined surfaces (e.g., sloped surfaces).

The invention claimed is: 
     
       1. A device, comprising:
 a substrate; 
 a first die on the substrate; 
 a second die on the first die, the second die spaced apart from the substrate by the first die; 
 a first resin on the substrate, the first die, and the second die, the first resin having a plurality of steps, and the first resin enclosing the first die and the second die; 
 a first conductive layer electrically coupled to the substrate, the first die, and the second die, the first conductive layer being on the plurality of steps of the first resin and extends continuously along the plurality of steps; and 
 a second resin on the first resin and on the first conductive layer. 
 
     
     
       2. The device of  claim 1 , wherein:
 the first resin includes a first sidewall; and 
 the second resin includes a second sidewall, the second sidewall is coplanar with the first sidewall of the first resin. 
 
     
     
       3. The device of  claim 1 , wherein the first conductive layer further comprises:
 a first contact on the substrate; 
 a second contact on the first die; 
 a third contact on the second die; 
 a first conductive via extending into the first resin to the first contact, the first conductive via electrically coupling the first conductive layer to the first contact; 
 a second conductive via extending into a first respective step of the plurality steps to the second contact, the second conductive via electrically coupling the first conductive layer to the second contact; and 
 a third conductive via extending into a second respective step of the plurality of steps to the third contact, the third conductive via electrically coupling the first conductive layer to the third contact. 
 
     
     
       4. The device of  claim 1 , wherein the first resin encases the first die and the second die and the second resin encases the first die and the first conductive layer. 
     
     
       5. The device of  claim 1 , wherein the first resin is a laser-direct-structuring-compatible resin, the second resin being a different material than the first resin. 
     
     
       6. The device of  claim 5 , wherein:
 the first resin includes a first sidewall and a second sidewall that are opposite to each other; and 
 the second resin includes a first sidewall and a second sidewall that are opposite to each other, the first sidewall of the first resin is coplanar with the first sidewall of the second resin. 
 
     
     
       7. The device of  claim 6  wherein the first sidewall of the first resin has a first dimension in a first direction and the first sidewall of the second resin has a second dimension in the first direction, the first dimension being larger than the second dimension. 
     
     
       8. The device of  claim 7 , further comprising a second conductive layer between the first resin and the second resin, the second conductive layer being separate and distinct from the first conductive layer, the second conductive layer being electrically coupled to the substrate. 
     
     
       9. The device of  claim 1 , further comprising a reservoir in the first resin, the second resin is in the reservoir and is aligned with the first conductive layer. 
     
     
       10. The device of  claim 9 , wherein the first resin includes a pillar that forms an outer sidewall and an interior wall of the reservoir. 
     
     
       11. A device, comprising:
 a substrate; 
 a first die on the substrate having a first surface and a plurality of first sidewalls; 
 a second die on the first surface, the second die having a second surface facing away from the first die and a plurality of second sidewalls; 
 a first laser-direct-structuring-compatible resin on the first surface, on the second surface, on the first sidewalls, and on the second sidewalls, the first resin having an angled surface; and 
 a first conductive layer on the angled surface of the first resin, the first conductive layer being electrically coupled to the first die, the second die, and the substrate; and 
 a second resin on the first resin, the second resin being a different material than the first resin. 
 
     
     
       12. The device of  claim 11  wherein the first conductive layer is between the second resin and the first resin. 
     
     
       13. The device of  claim 11 , wherein:
 the first resin entirely covers the second surface, the first sidewalls, and the second sidewalls; and 
 the first resin includes a plurality of outer sidewalls. 
 
     
     
       14. The device of  claim 11 , further comprising a second conductive layer on the first resin, the second conductive layer being separate and distinct from the first conductive layer, the second conductive layer being electrically coupled to the substrate. 
     
     
       15. The device of  claim 11 , wherein:
 one of the plurality of sidewalls of the second die extends past the first die and forms an opening; and 
 the first resin entirely and completely fills the opening. 
 
     
     
       16. A device, comprising:
 a substrate; 
 a first die on the substrate; 
 a second die on the first die and spaced apart from the substrate by the first die; 
 a first resin that is laser-direct-structuring-compatible on the substrate, the first die, the second die, and the first resin including one or more surfaces; 
 a first conductive layer electrically coupled to the substrate, the first die, the second die, and the conductive layer being on the one or more surfaces of the first resin; and 
 a second resin on the first resin and on the first conductive layer. 
 
     
     
       17. The device of  claim 16 , wherein the one or more surfaces is a plurality of surface with a staircase-like structure. 
     
     
       18. The device of  claim 16 , wherein the one or more surfaces includes an angled surface. 
     
     
       19. The device of  claim 16 , wherein the one or more surfaces includes an angled surface and another surface transverse to the angled surface. 
     
     
       20. The device of  claim 19 , further comprising a second conductive layer on the another surface, and wherein:
 the second conductive layer is configured to, in operation, be an electromagnetic interference (EMI) shield; and 
 the first conductive layer is on the angled surface.