Electronic device

Abstract

An electronic device is provided, including a substrate, and a plurality of first bonding pads. The substrate includes a bonding area. The plurality of first bonding pads are disposed on the substrate and disposed in the bonding area. A part of the plurality of first bonding pads are arranged along a first direction, and another part of the plurality of first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.

What is claimed is: 
     
       1. An electronic device, comprising:
 a substrate, comprising a bonding area; 
 a plurality of first bonding pads, disposed on the substrate, and disposed in the bonding area; and 
 a plurality of first dummy pads, disposed on the substrate, and disposed in the bonding area, 
 wherein a part of the plurality of first bonding pads are arranged along a first direction, and another part of the plurality of first bonding pads are arranged along a second direction, and 
 wherein there is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees, 
 wherein the substrate further comprises a working area, and the plurality of first dummy pads are disposed between the working area and the another part of the plurality of first bonding pads. 
 
     
     
       2. The electronic device as claimed in  claim 1 , wherein:
 the included angle is greater than or equal to 2 degrees and less than or equal to 20 degrees. 
 
     
     
       3. The electronic device as claimed in  claim 1 , wherein:
 the plurality of first dummy pads are arranged along the first direction. 
 
     
     
       4. The electronic device as claimed in  claim 1 , further comprising:
 a plurality of wires, disposed on the substrate, wherein the plurality of wires connects the working area and the first bonding pads, 
 wherein the electronic device has a normal direction, the plurality of wires are not overlapped with the plurality of first dummy pads when viewed along the normal direction. 
 
     
     
       5. The electronic device as claimed in  claim 4 , wherein:
 when viewed along the normal direction, at least one of the plurality of wires is separated from the closest first dummy pad by a distance, and the distance is greater than or equal to 6 micrometers. 
 
     
     
       6. The electronic device as claimed in  claim 1 , further comprising a plurality of second bonding pads and a plurality of second dummy pads disposed on the substrate, and disposed in the bonding area,
 wherein the plurality of second bonding pads are disposed farther away from the working area than the plurality of first bonding pads, and 
 wherein the plurality of second dummy pads are disposed between the plurality of first bonding pads and the plurality of second bonding pads. 
 
     
     
       7. The electronic device as claimed in  claim 6 , wherein the plurality of second bonding pads are arranged along the first direction. 
     
     
       8. The electronic device as claimed in  claim 7 , further comprising a driving circuit, wherein:
 a distance between the plurality of first bonding pads and the plurality of second bonding pads is greater than or equal to 500 micrometers. 
 
     
     
       9. The electronic device as claimed in  claim 8 , wherein:
 the distance between the plurality of first bonding pads and the plurality of second bonding pads is less than or equal to a width of the driving circuit. 
 
     
     
       10. The electronic device as claimed in  claim 8 , wherein:
 the distance between the plurality of first bonding pads and the plurality of second bonding pads is less than or equal to half of the width of the driving circuit. 
 
     
     
       11. The electronic device as claimed in  claim 1 , wherein:
 a third portion of the plurality of first bonding pads is arranged along a third direction, and 
 there is a second included angle between the first direction and the third direction, and the second included angle is greater than 0 degrees and less than 90 degrees. 
 
     
     
       12. The electronic device as claimed in  claim 11 , wherein:
 the second included angle between the first direction and the third direction is greater than or equal to 2 degrees and less than or equal to 20 degrees. 
 
     
     
       13. The electronic device as claimed in  claim 1 , wherein:
 a ratio of a width of the bonding area to a width of the working area is between 0.172 and 0.258. 
 
     
     
       14. The electronic device as claimed in  claim 1 , wherein:
 a distance between a lower edge of the working area and a lower edge of a peripheral area is less than 3200 micrometers. 
 
     
     
       15. The electronic device as claimed in  claim 1 , further comprising a driving circuit,
 wherein a distance between the plurality of first dummy pads and a side of the driving circuit is greater than or equal to 200 micrometers. 
 
     
     
       16. The electronic device as claimed in  claim 15 , wherein:
 a distance between the plurality of first dummy pads and an upper edge of the driving circuit is greater than 200 micrometers. 
 
     
     
       17. The electronic device as claimed in  claim 15 , wherein:
 a distance between two adjacent first dummy pads is greater than or equal to 88 micrometers. 
 
     
     
       18. The electronic device as claimed in  claim 17 , wherein:
 the distance between two adjacent first dummy pads is less than or equal to 200 micrometers. 
 
     
     
       19. The electronic device as claimed in  claim 15 , further comprising:
 a plurality of wires, disposed on the substrate, wherein the plurality of wires connects the working area and the plurality of first bonding pads, 
 wherein a minimum distance between one of the plurality of wires and the closest first dummy pads is greater than or equal to 6 micrometers.