Dual-type solder ball placement system

Abstract

A dual-type solder ball placement system is capable of allowing solder balls of the same type or solder balls having two different types to be mounted simultaneously through two ball mounting lines, thereby efficiently mounting the solder balls arranged with various purposes and patterns. Specifically, the dual-type solder ball placement system allows solder balls serving as terminals and core balls serving as supports to be mounted simultaneously through an inline method, thereby preventing a wafer, a unit, a chipset, and the like that become lighter, thinner, shorter, and smaller from being bent.

The invention claimed is: 
     
       1. A dual-type solder ball placement system comprising:
 a first ball mounting line configured to mount first solder balls at first set positions; and 
 a second ball mounting line configured to mount second solder balls at second set positions, 
 wherein the first ball mounting line comprises: 
 a first ball box configured to store the first solder balls; 
 a first ball tool configured to suck the first solder balls from the first ball box to mount the first solder balls at the first set positions; 
 a first flux box configured to store first flux; and 
 a first flux tool configured to apply the first flux to the first set positions where the first solder balls are mounted, and 
 the second ball mounting line comprises: 
 a second ball box configured to store the second solder balls; 
 a second ball tool configured to suck the second solder balls from the second ball box to mount the second solder balls at the second set positions; 
 a second flux box configured to store second flux; and 
 a second flux tool configured to apply the second flux to the second set positions where the second solder balls are mounted, 
 wherein the first flux tool is configured to move along a rail to apply the first flux of the first flux box to an object material conveyed through a first material transfer rail or a second material transfer rail, 
 wherein the first ball tool of the first ball mounting line is configured to move along the first rail to mount the first solder balls of the first ball box on the object material conveyed through the first material transfer rail or the second material transfer rail, 
 wherein the second flux tool is configured to move along a second rail to apply the second flux of the second flux box to the object material conveyed through the first material transfer rail or the second material transfer rail, 
 wherein the second ball tool of the second ball mounting line is configured to move along the second rail to mount the second solder balls of the second ball box on the object material conveyed through the first material transfer rail or the second material transfer rail, 
 wherein, in a case in which the first solder balls and the second solder balls of a same type are mounted on object materials, the first ball mounting line is configured to mount the first solder balls on the object material conveyed along one of the first material transfer rail and the second material transfer rail, while the second ball mounting line is configured to mount the second solder balls on the object material conveyed along the other of the first material transfer rail and the second material transfer rail, and 
 wherein, in a case in which the first solder balls and the second solder balls having different types are mounted on one object material, the first ball mounting line is configured to mount the first solder balls on the object material conveyed along one of the first material transfer rail and the second material transfer rail, while the second ball mounting line is configured to mount the second solder balls on the object material conveyed along the other of the first material transfer rail and the second material transfer rail, the object material conveyed along the other of the first material transfer rail and the second material transfer rail having the first solder balls mounted thereon through the first ball mounting line. 
 
     
     
       2. The dual-type solder ball placement system according to  claim 1 ,
 wherein, in a case in which the first solder balls are mounted onto one object material and the second solder balls having a type different from the first solder balls are mounted onto another object material, the first ball mounting line is configured to mount the first solder balls on the object material conveyed along one of the first material transfer rail and the second material transfer rail, while the second ball mounting line is configured to mount the second solder balls having the type different from the first solder balls on the object material conveyed along the other of the first material transfer rail and the second material transfer rail. 
 
     
     
       3. The dual-type solder ball placement system according to  claim 1 ,
 wherein the second ball tool has ball interference prevention grooves defined at portions corresponding to the first set positions of the first solder balls, and each of the ball interference prevention grooves has a hemispherical surface defined on an inside thereof. 
 
     
     
       4. The dual-type solder ball placement system according to  claim 1 ,
 wherein the first solder balls and the second solder balls have different sizes or shapes. 
 
     
     
       5. The dual-type solder ball placement system according to  claim 1 ,
 wherein the first solder balls comprise core balls configured to serve as supports between a wafer and a chipset, and the second solder balls are configured to serve as terminals between the wafer and the chipset.