US12130248B2ActiveUtilityA1

Heat source simulation structure

Assignee: ASIA VITAL COMPONENTS CHINA CO LTDPriority: Mar 2, 2021Filed: Mar 2, 2021Granted: Oct 29, 2024
Est. expiryMar 2, 2041(~14.6 yrs left)· nominal 20-yr term from priority
H05B 3/08H05B 3/12H05B 3/40H05B 2203/016H05B 3/0019G01K 7/02H05B 1/0227G01N 25/20H05B 3/42
44
PatentIndex Score
0
Cited by
14
References
8
Claims

Abstract

A heat source simulation structure includes a heating body and a heating member to form a simulation heat source main body for conducting heat. The simulation heat source main body is enclosed in an outer case and a heating substrate with electrical insulation and heat insulation properties to avoid dissipation of the heat. The heating member is electrically connected with an external power supply for heating the heating body. A thermocouple member is disposed on the heating body corresponding to the heating member. A temperature monitoring port is connected with a data collection meter for recording the temperature of the heating body. By means of the heat insulation design enclosing the simulation heat source main body, the contact thermal resistance between the heating member and the heating body is reduced, further to lower the heat loss of the heat source simulation structure and enhance the measurement precision and reliability.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A heat source simulation structure comprising:
 a carrier body, being heat-insulative and electro-insulative and including a base seat having a top surface, a heating substrate disposed on a top side of the base seat, and a temperature monitoring port disposed on the base seat for electrically connecting with a data collection meter; 
 an outer case, being heat-insulative and electro-insulative and having a case bottom frame and a case cover connected with the case bottom frame, the case bottom frame correspondingly capped on the carrier body and located on the top surface of the base seat, the outer case and the carrier body together defining internally therebetween a receiving space, the case cover having a notch; and 
 a heat source main body including:
 a heating body covered by the outer case in the receiving space and disposed on the heating substrate in contact with the heating substrate, at least one through hole being disposed on one side of the heating body, other sides of the heating body enclosed by the outer case and the carrier body, wherein the data collection meter records the temperature of the heating body via the temperature monitoring port; 
 at least one heating member, one end of the heating member being disposed in the through hole of the heating body, the other end of the heating member extending out of the notch of the outer case to electrically connect with an external power supply for heating the heating body; and 
 at least one thermocouple member disposed on one side of the heating body. 
 
 
     
     
       2. The heat source simulation structure as claimed in  claim 1 , wherein the junction between the end of the heating member and the through hole is welded to connect the end of the heating member and the through hole. 
     
     
       3. The heat source simulation structure as claimed in  claim 1 , wherein a heating filament or a heating resistor filament is disposed in the heating body. 
     
     
       4. The heat source simulation structure as claimed in  claim 1 , wherein the heating body and the heating member are made of copper or stainless steel. 
     
     
       5. The heat source simulation structure as claimed in  claim 1 , wherein the heating member is an electrical heating pipe or a heating bar. 
     
     
       6. The heat source simulation structure as claimed in  claim 1 , wherein the outer case and the heating substrate are made of fiber glass with heat insulation and electrical insulation effect. 
     
     
       7. The heat source simulation structure as claimed in  claim 1 , wherein the outer case is disposed on one side of the heating body distal from the base seat for insulation and heat transfer. 
     
     
       8. The heat source simulation structure as claimed in  claim 1 , wherein the heat source simulation structure is solely used or synchronously used with a test platform.

Join the waitlist — get patent alerts

Track US12130248B2 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.