Organic light emitting diode display panel and manufacturing method thereof

Abstract

An organic light emitting diode display panel of the present disclosure includes a substrate, an array layer disposed on the substrate, a specific recess disposed on a surface of the array layer away from the substrate, an electroluminescent layer disposed on the array layer, and a thin film encapsulation layer disposed on the electroluminescent layer and covering the electroluminescent layer. The thin film encapsulation layer extends into the specific recess and fills the specific recess, and special structures which engage with each other are formed at a position corresponding to the specific recess.

What is claimed is: 
     
       1. An organic light emitting diode display panel, comprising:
 a substrate; 
 an array layer disposed on the substrate, wherein the array layer comprises a display area and a non-display area surrounding the display area, a plurality of specific recesses are formed on a surface of the array layer away from the substrate, and the specific recesses are separated from each other and are arranged in a matrix of rows and columns in the non-display area; 
 an electroluminescent layer disposed on the array layer; and 
 a thin film encapsulation layer disposed on the electroluminescent layer and covering the electroluminescent layer, wherein the thin film encapsulation layer extends into the specific recesses and fills the specific recesses, a diameter of one of the specific recesses gradually decreases along a direction from the substrate to the thin film encapsulation layer, and special structures which engage with each other are formed at a position corresponding to the specific recesses. 
 
     
     
       2. The organic light emitting diode display panel as claimed in  claim 1 , wherein the array layer comprises an array sub-layer and a first inorganic film layer that are sequentially disposed on the substrate, and the specific recesses are formed on a surface of the first inorganic film layer away from the substrate; and
 the thin film encapsulation layer comprises a second inorganic film layer, an organic film layer, and a third inorganic film layer that are sequentially disposed on the electroluminescent layer, and the third inorganic film layer extends into the specific recesses and fills the specific recesses, and the special structures which engage with each other are formed at the position corresponding to the specific recesses. 
 
     
     
       3. The organic light emitting diode display panel as claimed in  claim 1 , wherein the non-display area comprises a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side; and
 at least one specific recess is formed on the first side, at least one specific recess is formed on the second side, at least one specific recess is formed on the third side, and at least one specific recess is formed on the fourth side. 
 
     
     
       4. The organic light emitting diode display panel as claimed in  claim 1 , wherein the specific recesses are arranged in a regular matrix in the non-display area. 
     
     
       5. The organic light emitting diode display panel as claimed in  claim 4 , wherein distances between each two adjacent specific recesses are the same, and numbers of the specific recesses arranged in each row are the same, and numbers of the specific recesses arranged in each column are the same. 
     
     
       6. The organic light emitting diode display panel as claimed in  claim 1 , wherein the specific recesses are arranged in an irregular matrix in the non-display area. 
     
     
       7. The organic light emitting diode display panel as claimed in  claim 6 , wherein distances between each two adjacent specific recesses are different, and numbers of the specific recesses arranged in different rows are different, and numbers of the specific recesses arranged in different columns are different. 
     
     
       8. The organic light emitting diode display panel as claimed in  claim 1 , wherein special structures comprise:
 the specific recesses disposed on the surface of the array layer away from the substrate; and 
 a plurality of specific protrusions disposed on a surface of the thin film encapsulation layer near the substrate, wherein the specific protrusions are arranged in one-to-one correspondence with the specific recesses, a shape of the specific protrusion matches a shape of the specific recess, and the specific protrusions fill the specific recesses such that the special structures which engage with each other are formed. 
 
     
     
       9. An organic light emitting diode display panel, comprising:
 a substrate; 
 an array layer disposed on the substrate, wherein the array layer comprises a display area and a non-display area surrounding the display area, a plurality of specific recesses are formed on a surface of the array layer away from the substrate, the specific recesses are arranged in an irregular matrix in the non-display area, and the plurality of specific recesses are separated from each other and are arranged in a matrix of rows and columns in the non-display area; 
 an electroluminescent layer disposed on the array layer; and 
 a thin film encapsulation layer disposed on the electroluminescent layer and covering the electroluminescent layer, wherein the thin film encapsulation layer extends into the specific recesses and fills the specific recesses, and special structures which engage with each other are formed at a position corresponding to the specific recesses. 
 
     
     
       10. The organic light emitting diode display panel as claimed in  claim 9 , wherein the array layer comprises an array sub-layer and a first inorganic film layer that are sequentially disposed on the substrate, and the specific recesses are formed on a surface of the first inorganic film layer away from the substrate; and
 the thin film encapsulation layer comprises a second inorganic film layer, an organic film layer, and a third inorganic film layer that are sequentially disposed on the electroluminescent layer, and the third inorganic film layer extends into the specific recesses and fills the specific recesses, and the special structures which engage with each other are formed at the position corresponding to the specific recesses. 
 
     
     
       11. The organic light emitting diode display panel as claimed in  claim 9 , wherein the non-display area comprises a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side; and
 at least one specific recess is formed on the first side, at least one specific recess is formed on the second side, at least one specific recess is formed on the third side, and at least one specific recess is formed on the fourth side. 
 
     
     
       12. The organic light emitting diode display panel as claimed in  claim 9 , wherein distances between each two adjacent specific recesses are different, and numbers of the specific recesses arranged in different rows are different, and numbers of the specific recesses arranged in different columns are different. 
     
     
       13. The organic light emitting diode display panel as claimed in  claim 9 , wherein special structures comprise:
 the specific recesses disposed on the surface of the array layer away from the substrate; and 
 a plurality of specific protrusions disposed on a surface of the thin film encapsulation layer near the substrate, wherein the specific protrusions are arranged in one-to-one correspondence with the specific recesses, a shape of the specific protrusion matches a shape of the specific recess, and the specific protrusions fill the specific recesses such that the special structures which engage with each other are formed. 
 
     
     
       14. A manufacturing method of an organic light emitting diode display panel, comprising:
 providing a substrate and forming an array layer on the substrate, wherein the array layer comprises a display area and a non-display area surrounding the display area; 
 forming a plurality of regular recesses on a surface of the array layer away from the substrate; 
 changing a shape of the regular recess to form a plurality of specific recesses, wherein the specific recesses are arranged in an irregular matrix in the non-display area, and the plurality of specific recesses are separated from each other and are arranged in a matrix of rows and columns in the non-display area; 
 sequentially forming an electroluminescent layer and a thin film encapsulation layer on the array layer; and 
 filling the specific recess with the thin film encapsulation layer to form special structures which engage with each other.