US11655402B2ActiveUtilityA1

Basic ionic liquids compositions and elements including the same

Assignee: NITTO DENKO CORPPriority: Nov 21, 2017Filed: Nov 20, 2018Granted: May 23, 2023
Est. expiryNov 21, 2037(~11.3 yrs left)· nominal 20-yr term from priority
C09J 7/10C09J 2301/408C08K 5/43C09J 11/06C09J 7/40C09J 133/00C08K 5/14Y02P20/582C08K 5/19C09J 2433/00C09J 7/30C09J 2301/502C09J 9/02C09J 9/00C09J 133/02C09J 7/385
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Cited by
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References
19
Claims

Abstract

An electrically debondable adhesive composition is described. The adhesive is comprised of a basic ionic liquid and an optionally crosslinked polymer, wherein the basic ionic liquid is comprised of an amino-ammonium cation and a bis(fluorosulfonyl)imide anion.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. An adhesive composition comprising:
 a cationic ammonium compound of the following formula: 
 
       
         
           
           
               
               
           
         
       
       wherein:
 R 1 , R 2 , R 3 , R 4  and R 5  are independently H, optionally substituted C 1-5  hydrocarbyl, optionally substituted C 1-5  hydrocarbyl-OH, or optionally substituted C 1-5  hydrocarbyl-O—C 1-5  hydrocarbyl, wherein n is 1 or 2; and 
 a sulfonimide anion of the following formula: 
 
       
         
           
           
               
               
           
         
       
       wherein:
 R 6  is —F or C 1-3  fluorohydrocarbyl. 
 
     
     
       2. The adhesive composition of  claim 1 , wherein R 1 , R 2 , R 3 , R 4  and R 5  are independently H, —CH 3 , —CH 2 CH 3 , —CH 2 CH 2 CH 3 , —CH 2 OCH 3 , —CH 2 CH 2 OCH 3 , —CH 2 OCH 2 CH 3 , —CH 2 CH 2 CH 2 OCH 3 , —CH 2 OCH 2 CH 2 CH 3 , —CH 2 CH 2 OCH 2 CH 3 —CH 2 CH 2 CH 2 OCH 2 CH 3 , —CH 2 CH 2 CH 2 OCH 2 CH 2 CH 3 , or —CH 2 CH 2 OCH 2 CH 2 CH 3 , —CH 2 OH, —CH 2 CH 2 OH, —CH 2 CH 2 CH 2 OH, or —CH 2 CH 2 CH 2 CH 2 OH. 
     
     
       3. The adhesive composition of  claim 2 , wherein the cationic ammonium compound is: 
       
         
           
           
               
               
           
         
       
       or a combination thereof. 
     
     
       4. The adhesive composition of  claim 3  wherein R 6  is F. 
     
     
       5. The adhesive composition of  claim 1 , further comprising a polymer wherein the polymer comprises an acrylate polymer, a methacrylate polymer, or a combination of both acrylate and methacrylate polymers. 
     
     
       6. The adhesive composition of  claim 5 , wherein the polymer comprises acrylic acid, C1-14 hydrocarbyl acrylate or C1-14 hydrocarbyl methacrylate monomers. 
     
     
       7. The adhesive composition of  claim 6 , wherein the polymer is crosslinked with an epoxy crosslinker; wherein the epoxy crosslinker is N,N,N′,N′-tetraglycidyl-m-xylenediamine. 
     
     
       8. A structure comprising: 1) a first electro-conductive surface, 2) a second electro-conductive surface, and 3) the adhesive composition of  claim 7  disposed between the first electro-conductive surface and the second electro-conductive surface. 
     
     
       9. The structure of  claim 8 , further comprising a power supply wherein at least one of the first electro-conductive surface and the second electro-conductive surface are in electrical communication with a DC power supply, creating a closeable electrical circuit, and wherein the DC power supply is about 3 volts to about 100 volts. 
     
     
       10. The structure of  claim 9 , wherein the first electro-conductive surface or the second electro-conductive surface comprises an electro-conductive metal, a mixed metal, an alloy, a metal oxide, a mixed metal oxide, a plastic, a carbonaceous material, a composite metal, or a conductive polymer. 
     
     
       11. The structure of  claim 10 , wherein the electro-conductive material comprises aluminum. 
     
     
       12. The structure of  claim 10 , wherein the application of an electromotive force to the electro-conductive surface reduces the adhesion of the adhesive composition. 
     
     
       13. The structure of  claim 12 , wherein the first electro-conductive surface is a surface of a first electro-conductive layer and the second electro-conductive surface is a surface of a second electro-conductive layer, wherein the first electro-conductive layer and the second electro-conductive layer are about 20 nm to about 200 μm thick. 
     
     
       14. The structure of  claim 13 , wherein the electro-conductive layers are disposed upon a substrate wherein the substrate comprises wood, cardboard, fiberglass or non-electro-conductive plastic. 
     
     
       15. The structure of  claim 14 , wherein the adhesive composition has a reduced corrosive effect upon the first electro-conductive surface or the second electro-conductive surface. 
     
     
       16. The structure of  claim 15 , wherein the reduced corrosive effect is observable under conditions of high humidity and high temperature over a period of about 15 minutes to about 300 hours. 
     
     
       17. An adhesive member comprising:
 the adhesive composition of  claim 7  formed into an adhesive layer; and 
 at least one release liner on at least one side of the adhesive layer. 
 
     
     
       18. The adhesive member of  claim 17 , comprising a release liner on each side of the adhesive layer. 
     
     
       19. A method of adhering the adhesive composition of  claim 7 , to a substrate, the method comprising:
 applying the adhesive composition to a first electrically conductive substrate; and 
 applying the adhesive composition to a second electrically conductive substrate such that the adhesive composition is between the first electrically conductive substrate and the second electrically conductive substrate.

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