Flexible polymeric film including reinforcement layer
Abstract
A flexible polymeric film includes a reinforcement layer and a base layer. The reinforcement layer includes a lamella and a plurality of columns. The columns are on a surface of the lamella. Each of the columns extends in a direction and is separated from a neighboring column by a gap. The base layer is coupled to the columns and portions of the surface of the lamella in the gaps between the columns. The base layer is less rigid than the reinforcement layer. The flexible polymeric film can be produced by spraying a precursor onto a substrate. A layer of the precursor is formed on the substrate and exposed to an energy beam to form a preliminary film on the substrate. The columns can be formed from a plurality of portions of the preliminary film. The lamella is formed on top of the preliminary film that is formed with the columns.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method for producing a flexible polymeric film, the method comprising:
forming a film on a substrate;
forming a plurality of first columns and a plurality of second columns from a plurality of portions of the film, the plurality of first columns more rigid than other portions of the film, each of the plurality of first columns separated from a neighboring first column by a gap, the plurality of second columns having a reverse shape of the plurality of first columns, each of the plurality of second columns below the gap between two first columns of the plurality of first columns for reducing optical distortions caused by the plurality of first columns; and
forming a lamella on the film.
2. The method of claim 1 , wherein forming the plurality of first columns and the plurality of second columns from the plurality of portions of the film comprises:
forming the plurality of first columns through cross-linking molecules of one or more materials of the film.
3. The method of claim 1 , wherein forming the plurality of first columns and the plurality of second columns from the plurality of portions of the film comprises:
exposing the plurality of portions of the film to plasma radicals, laser, electron beams, or ultraviolet.
4. The method of claim 1 , wherein forming the plurality of first columns and the plurality of second columns from the plurality of portions of the film comprises:
exposing the plurality of portions of the film to plasma radicals having a first power; and
exposing the other portions of the film to plasma radicals having a second power, the second power lower than the first power.
5. The method of claim 1 , wherein forming the plurality of first columns and the plurality of second columns from the plurality of portions of the film comprises:
exposing the plurality of portions of the film to a first type of plasma radicals; and
exposing the other portions of the film to a second type of plasma radicals, the second type of plasma radical different from the first type of plasma radicals.
6. The method of claim 1 , wherein forming the lamella on the film comprises:
spraying a second precursor onto the film;
forming a layer of the second precursor on the film; and
exposing the layer of the second precursor to an energy beam to transform the layer of the second precursor to the lamella.
7. The method of claim 1 , wherein forming the lamella on the film comprises:
exposing the film to plasma radicals, laser, or electrons to transform a portion of the film formed with the plurality of first columns to the lamella.
8. The method of claim 1 , wherein forming the film on the substrate comprises:
spraying a precursor onto the substrate; and
forming the film from a layer of the precursor on the substrate.
9. The method of claim 8 , wherein forming the film from the layer of the precursor on the substrate comprises:
exposing the layer of the precursor to an energy beam to form the film on the substrate.
10. The method of claim 8 , wherein forming the film on the substrate further comprises:
spraying an additional precursor onto the layer of the precursor to form a layer of the additional precursor on the layer of the precursor.
11. The method of claim 10 , wherein forming the film on the substrate further comprises:
exposing the layer of the additional precursor to an energy beam to form the film on the substrate.
12. The method of claim 8 , wherein forming the film on the substrate comprises:
exposing the layer of the precursor to an energy beam to form an initial film;
spraying an additional precursor onto the initial film to form a layer of the additional precursor; and
exposing the layer of the additional precursor to an energy beam to form the film on the substrate.
13. The method of claim 1 , further comprising:
forming an additional lamella on which the plurality of second columns are arranged.
14. The method of claim 1 , wherein the other portions of the film are less rigid than the plurality of second columns.
15. The method of claim 1 , wherein a width of each of the plurality of first columns is larger than a width of each of the gaps.
16. The method of claim 1 , wherein a width of each of the plurality of first columns is at most 500 nanometers.
17. The method of claim 1 , wherein a width of each of the gaps is at most 250 nanometers.
18. The method of claim 1 , wherein a thickness of the lamella is from 100 nanometers to 20 micrometers.
19. The method of claim 1 , wherein a ratio of a thickness of each of the plurality of first column to a thickness of the lamella is equal to or larger than 10.
20. The method of claim 1 , further comprising:
forming a passivation layer having a higher elasticity than the film, the passivation layer arranged on a first surface of the lamella that opposes a second surface of the lamella where the plurality of first columns are.Join the waitlist — get patent alerts
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