US11575819B2ActiveUtilityA1
Image sensor
Est. expiryFeb 6, 2040(~13.5 yrs left)· nominal 20-yr term from priority
Inventors:Jae Won Lee
H04N 23/11H10F 39/807H10F 39/8053H10F 39/8063H10F 39/8067H10F 39/802H10F 39/8027H10F 39/811H10F 39/805H10F 39/184H10F 39/182G02B 1/115H04N 23/55G02B 5/208G02B 3/0056H04N 23/84H04N 25/76H04N 23/45H01L 27/14627H04N 5/2254H01L 27/14645H01L 27/14649H01L 27/14621H01L 27/14636H01L 27/14607H04N 9/045H01L 27/1462H04N 5/2258
52
PatentIndex Score
0
Cited by
5
References
20
Claims
Abstract
An image sensor includes a color sensor chip configured to generate a color image by sensing visible light in incident light; a light transfer layer disposed under the color sensor chip, and including an infrared light pass filter which filters infrared light from light having passed through the color sensor chip; and a depth sensor chip disposed under the light transfer layer, and configured to generate a depth image by sensing the infrared light.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. An image sensor comprising:
a color sensor chip configured to detect visible light in light incident to the color sensor chip and generate a color image;
a light transfer layer disposed under the color sensor chip and configured to receive light having passed through the color sensor chip, the light transfer layer including an infrared light pass filter allowing infrared light of the received light to pass through the infrared light pass filter; and
a depth sensor chip disposed under the light transfer layer, and configured to receive the infrared light from the light transfer layer and generate a depth image based on the infrared light.
2. The image sensor according to claim 1 , wherein the light transfer layer further includes an infrared light microlens configured to collect the infrared light.
3. The image sensor according to claim 2 , wherein the light transfer layer further includes an antireflection layer which is disposed between the infrared light pass filter and the infrared light microlens.
4. The image sensor according to claim 3 , wherein a refractive index of the antireflection layer is smaller than a refractive index of the infrared light pass filter and is larger than a refractive index of the infrared light microlens.
5. The image sensor according to claim 3 , wherein the antireflection layer includes a plurality of layers whose refractive indexes decrease toward the infrared light microlenses from the infrared light pass filter.
6. The image sensor according to claim 2 , wherein the infrared light microlens is disposed to correspond to a photoelectric conversion element of the color sensor chip.
7. The image sensor according to claim 6 , wherein the infrared light microlens is disposed to correspond to a portion of a photoelectric conversion element of the depth sensor chip.
8. The image sensor according to claim 6 , wherein the infrared light microlens is disposed to correspond to a photoelectric conversion element of the depth sensor chip.
9. The image sensor according to claim 2 , wherein the infrared light microlens is disposed to correspond to a plurality of photoelectric conversion elements of the color sensor chip.
10. The image sensor according to claim 9 , wherein the infrared light microlens is disposed to correspond to a photoelectric conversion element of the depth sensor chip.
11. An image sensor comprising:
a color sensor chip and a depth sensor chip that are stacked to vertically overlap with each other, each of the color sensor chip and the depth sensor chip includes a photoelectric conversion element configured to generate photocharges in response to incident light received by the color sensor chip or the depth sensor chip; and
an infrared light pass filter disposed between the photoelectric conversion element of the color sensor chip and the photoelectric conversion element of the depth sensor chip, and configured to allow infrared light included in light having passed through the color sensor chip to pass through the infrared light pass filter.
12. The image sensor according to claim 11 , further comprising:
an infrared light microlens configured to collect the infrared light.
13. The image sensor according to claim 12 , further comprising:
an antireflection layer disposed between the infrared light pass filter and the infrared light microlens.
14. The image sensor according to claim 13 , wherein a refractive index of the antireflection layer is smaller than a refractive index of the infrared light pass filter and is larger than a refractive index of the infrared light microlens.
15. The image sensor according to claim 13 , wherein the antireflection layer includes a plurality of layers whose refractive indexes decrease toward the infrared light microlenses from the infrared light pass filter.
16. The image sensor according to claim 11 , further comprising a first wiring layer disposed between the color sensor chip and the infrared light pass filter.
17. The image sensor according to claim 11 , further comprising a second wiring layer disposed between the infrared light pass filter and the depth sensor chip.
18. The image sensor according to claim 11 , wherein the photelectric conversion element of at least one of the color sensor chip and the depth sensor chip includes a photodiode, a phototransistor, a photogate, a pinned photodiode or a combination thereof.
19. The image sensor according to claim 11 , wherein the photelectric conversion element of the depth sensor chip has a larger volume than that of the photelectric conversion element of the color sensor chip.
20. The image sensor according to claim 11 , wherein the infrared light pass filter configured to allow the infrared light having wavelength in a range between 840 to 950 nm.Join the waitlist — get patent alerts
Track US11575819B2 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.