Image sensor package including bonding wire inside support member

Abstract

An image sensor package includes a substrate connected to an image sensor by a bonding wire; a sub-housing disposed adjacent to an upper surface of the substrate so as to surround the bonding wire; and a support member disposed at least partially in a space between the sub-housing and the substrate to limit elastic deformation of the sub-housing, and a portion of the bonding wire is disposed inside the support member.

What is claimed is: 
     
       1. An image sensor package comprising:
 a substrate connected to an image sensor by a bonding wire; 
 a sub-housing disposed in contact with an upper surface of the substrate so as to surround the bonding wire; and 
 a support member disposed at least partially in a space between the sub-housing and the substrate to limit elastic deformation of the sub-housing, 
 wherein a portion of the bonding wire is disposed inside the support member and a remaining portion of the bonding wire is disposed outside the support member, 
 the substrate comprises an accommodation space accommodating the image sensor, and 
 an upper surface of the support member is in contact with the sub-housing, and a lower surface of the support member is in contact with the upper surface of the substrate. 
 
     
     
       2. The image sensor package of  claim 1 , wherein a length of the bonding wire from one end of the bonding wire connected to the substrate to a vertex of the bonding wire is disposed inside the support member. 
     
     
       3. The image sensor package of  claim 1 , further comprising a filter attached to the sub-housing. 
     
     
       4. The image sensor package of  claim 3 , wherein an upper surface of the sub-housing comprises a step portion, and the filter is attached to the step portion. 
     
     
       5. The image sensor package of  claim 1 , wherein the accommodation space is a hole that passes through the substrate. 
     
     
       6. The image sensor package of  claim 5 , further comprising a reinforcing board coupled to the substrate so as to cover the accommodation space. 
     
     
       7. The image sensor package of  claim 6 , wherein the image sensor is in contact with the reinforcing board. 
     
     
       8. The image sensor package of  claim 1 , wherein a first end of the bonding wire is attached to an upper surface of the image sensor, and a second end of the bonding wire is attached to the upper surface of the substrate, and
 the upper surface of the image sensor and the upper surface of the substrate are not coplanar. 
 
     
     
       9. The image sensor package of  claim 1 , wherein a shortest distance between an upper surface of the image sensor and a plane containing a lower surface of the substrate is less than a shortest distance between the upper surface of the substrate and the plane containing the lower surface of the substrate. 
     
     
       10. An image sensor package comprising:
 a substrate connecting to an image sensor by a bonding wire; 
 a sub-housing disposed in contact with an upper surface of the substrate so as to surround the bonding wire; and 
 a support member disposed at least partially in a space between the sub-housing and the substrate to limit elastic deformation of the sub-housing, 
 wherein a portion of the bonding wire is disposed inside the support member, 
 the substrate comprises an accommodation space accommodating the image sensor, and 
 an upper surface of the support member, is in contact with the sub-housing and a lower surface of the support member is in contact with the upper surface of the substrate, 
 wherein an inner side surface of the support member comprises an inclined surface. 
 
     
     
       11. The image sensor package of  claim 10 , wherein the inner side surface of the support member has an inner diameter that increases continuously from the upper surface of the support member to the lower surface of the support member. 
     
     
       12. A camera module comprising:
 an image sensor package comprising:
 a substrate connected to an image sensor by a bonding wire; 
 a sub-housing disposed in contact with an upper surface of the substrate so as to surround the bonding wire; and 
 a support member disposed at least partially in a space between the sub-housing and the substrate to limit elastic deformation of the sub-housing; and 
 
 a lens module coupled to an object side of the image sensor package, 
 wherein a portion of the bonding wire is disposed inside the support member, 
 the substrate comprises an accommodation space accommodating the image sensor, and 
 an upper surface of the support member is in contact with the sub-housing, and a lower surface of the support member is in contact with the upper surface of the substrate.