Service system and server

Abstract

A service system and a server capable of increasing an operation rate of a production base are provided. The server acquires operation information of a component mounter in a mounting work from a host computer in the production base. The server generates analyzed result data obtained by analyzing the operation information based on the types of the manufacturers (component manufacturer and the package manufacturer) of electronic component and the package. The server transmits the generated analyzed result data to host computers in the other production bases.

The invention claimed is: 
     
       1. A service system comprising:
 a first data processing circuit provided in a first production base to control multiple production lines; 
 a second data processing circuit provided in a second production base located differently from the first production base to control multiple productions lines; and 
 a server connected to the first data processing circuit and the second data processing circuit, 
 wherein at least one component mounter configured to mount an electronic component on a board is provided in each of the first production base and the second production base, 
 wherein 
 the component mounter includes a supply device configured to supply the electronic component from an accommodation member in which electronic components are accommodated, and is configured to perform mounting work of mounting the electronic component supplied from the supply device on the board, and 
 the server is configured to acquire operation information of the component mounter, being obtained in the mounting work, from the first data processing circuit, generate analyzed result data obtained by analyzing the operation information based on a type of a manufacturer of at least one of the electronic components and the accommodation member, and transmit the generated analyzed result data to the second data processing circuit. 
 
     
     
       2. The service system according to  claim 1 , wherein
 the second data processing circuit is configured to perform an inquiry to the server in response to a start of the mounting work of producing a new type of the board by the component mounter provided in the second production base, and 
 the server is configured to transmit the analyzed result data to the second data processing circuit in response to the inquiry from the second data processing circuit. 
 
     
     
       3. The service system according to  claim 1 , wherein
 the server is configured to acquire, as the operation information, error information regarding an error in which it is not possible to acquire the electronic component from the supply device in the mounting work, from the first data processing circuit, and calculate, as the analyzed result data, an error occurrence rate for each manufacturer of at least one of the electronic component and the accommodation member. 
 
     
     
       4. The service system according to  claim 3 , wherein,
 in a case where the error in which it is not possible to acquire the electronic component from the supply device in the mounting work occurs, and then the error occurrence rate is improved by changing at least one of setting data of the component mounter in which the error has occurred and a mounting member mounted on the component mounter, the first data processing circuit is configured to transmit to the server, countermeasure information obtained by associating details of the change of the setting data and the mounting member with manufacturers of the electronic component and the accommodation member. 
 
     
     
       5. The service system according to  claim 3 , wherein
 the second data processing circuit is configured to acquire the error occurrence rate from the server as the analyzed result data, and select a manufacturer in which the error occurrence rate is lower, as a manufacturer of at least one of the electronic component and the accommodation member used in the mounting work. 
 
     
     
       6. The service system according to  claim 3 , wherein
 the second data processing circuit is configured to acquire the error occurrence rate from the server as the analyzed result data, and sort and 
 display manufacturers of at least one of the electronic component and the accommodation member usable in the mounting work in an ascending order or a descending order of the error occurrence rate. 
 
     
     
       7. The service system according to  claim 1 , wherein
 the server notifies the corresponding manufacturer of the analyzed result data. 
 
     
     
       8. The service system according to  claim 1 , wherein
 a first host computer configured to control the component mounter in the first production base and to include the first data processing circuit is provided in the first production base, 
 a second host computer configured to control the component mounter of the second production base and to include the second data processing circuit is provided in the second production base, and 
 the server is connected to each of the first host computer and the second host computer via a wide area network. 
 
     
     
       9. A server connected to a first data processing circuit provided in a first production base and a second data processing circuit provided in a second production base located differently from the first production base, the first data processing circuit controlling multiple production lines in the first production base and the second data processing circuit controlling multiple production lines in the second production base,
 wherein a component mounter configured to mount an electronic component on a board is provided in each of the first production base and the second production base, 
 the component mounter includes a supply device configured to supply the electronic component from an accommodation member in which electronic components are accommodated, and performs a mounting work of mounting the electronic component supplied from the supply device on the board is performed, and 
 wherein the server comprises circuitry configured to acquire operation information of the component mounter, being obtained in the mounting work, from the first data processing circuit, generate analyzed result data obtained by analyzing the operation information based on a type of a manufacturer of at least one of the electronic components and the accommodation member, and transmit the generated analyzed result data to the second data processing circuit.