Flexible display panel and preparation method

Abstract

A flexible display panel includes: a first organic layer; a blocking layer disposed on the first organic layer; and a first adhesion enhancing layer disposed between the first organic layer and the blocking layer.

What is claimed is: 
     
       1. A flexible display panel, comprising:
 a first organic layer; 
 a blocking layer formed on the first organic layer; and 
 a first adhesion enhancing layer formed between the first organic layer and the blocking layer, 
 wherein the first adhesion enhancing layer is prepared from silica nanotubes which are distributed on a first surface of the first organic layer, and 
 wherein a ratio of an area, where the silica nanotubes contact the first organic layer, to an area of the first surface is between 10% and 80%. 
 
     
     
       2. The flexible display panel of  claim 1 , further comprising a second organic layer formed on the blocking layer. 
     
     
       3. The flexible display panel of  claim 2 , further comprising a thin-film transistor (TFT) device, an emission layer of organic light-emitting diode (OLED) and a thin film encapsulation layer which are disposed on the second organic layer in sequence. 
     
     
       4. The flexible display panel of  claim 2 , further comprising a second adhesion enhancing layer formed between the blocking layer and the second organic layer. 
     
     
       5. The flexible display panel of  claim 2 , wherein the first organic layer and the second organic layer are prepared from at least one material selected from the group consisting of polyimide, polyetherimide, polyphenylene sulfide, and polyarylate. 
     
     
       6. A flexible display panel, comprising:
 a first organic layer; 
 a blocking layer formed on the first organic layer; 
 a first adhesion enhancing layer formed between the first organic layer and the blocking layer 
 a second organic layer formed on the blocking layer; and 
 a second adhesion enhancing layer formed between the blocking layer and the second organic layer, 
 wherein at least one of the first adhesion enhancing layer and the second adhesion enhancing layer is prepared from silica nanotubes. 
 
     
     
       7. The flexible display panel of  claim 6 , further comprising a thin-film transistor (TFT) device, an emission layer of organic light-emitting diode (OLED) and a thin film encapsulation layer which are disposed on the second organic layer in sequence. 
     
     
       8. The flexible display panel of  claim 6 , wherein the first organic layer and the second organic layer are prepared from at least one material selected from the group consisting of polyimide, polyetherimide, polyphenylene sulfide, and polyarylate. 
     
     
       9. The flexible display panel of  claim 8 , wherein a thickness of the first organic layer and a thickness of the second organic layer are both between 20 micrometers and 500 micrometers. 
     
     
       10. The flexible display panel of  claim 9 , wherein the first organic layer is prepared from polyimide, and the thickness of the first organic layer is 100 micrometers. 
     
     
       11. The flexible display panel of  claim 6 , wherein the blocking layer is prepared from at least one material selected from the group consisting of silicon dioxide, amorphous silicon, and silicon nitride. 
     
     
       12. The flexible display panel of  claim 11 , wherein the thickness of the blocking layer is between 100 nanometers and 2000 nanometers. 
     
     
       13. The flexible display panel of  claim 12 , wherein the blocking layer is prepared from silicon dioxide, and the thickness of the blocking layer is 500 nanometers. 
     
     
       14. A method of preparing a flexible display panel, comprising:
 (S 10 ) forming a wet film through coating an organic fluid on a rigid substrate; 
 (S 20 ) forming a first adhesion enhancing layer on the surface of the wet film; 
 (S 30 ) curing the wet film having the first adhesion enhancing layer coated thereon, so that the cured wet film becomes a first organic layer; 
 (S 40 ) forming a blocking layer on the surface of the first adhesion enhancing layer; 
 (S 50 ) forming a second adhesion enhancing layer on the surface of the blocking layer; 
 (S 60 ) forming a second organic layer on the second adhesion enhancing layer; 
 (S 70 ) forming a thin-film transistor (TFT) device, an emission layer of organic light-emitting diode (OLED) and a thin film encapsulation layer on the second organic layer in order; and 
 (S 80 ) removing the rigid substrate. 
 
     
     
       15. The method of  claim 14 , wherein at least one of the first adhesion enhancing layer and the second adhesion enhancing layer is prepared from silica nanotubes. 
     
     
       16. The method of  claim 14 , wherein the blocking layer is prepared from at least one material selected from the group consisting of silicon dioxide, amorphous silicon, and silicon nitride. 
     
     
       17. The method of  claim 14 , wherein the first organic layer and the second organic layer are prepared from at least one material selected from the group consisting of polyimide, polyetherimide, polyphenylene sulfide, and polyarylate.