Solid-state miniature atomic clock and methods of use

Abstract

Solid-state miniature atomic clock (SMAC) within the form factor of an integrated circuit chip (aka microchip) or flexible device. The present invention includes architectures and methods of manufacture of SMACs. SMACs may include one or more vias, with some or all of the vias containing or other material suitable for an antenna. In addition, the SMAC may include a heating device for temperature stabilization.

What is claimed is: 
     
       1. A flexible circuit electronic device, comprising:
 a first flexible circuit layer, comprising a first sensor; 
 a second flexible circuit layer attached to the first flexible circuit layer, wherein the second flexible circuit layer comprises a cavity; 
 a third flexible circuit layer attached to the second flexible circuit layer, wherein the third flexible circuit layer comprises a second sensor; 
 at least one fullerene molecule within the cavity; 
 a first magnet attached to the first flexible circuit layer; and 
 a second magnet attached to the third flexible circuit layer. 
 
     
     
       2. The flexible circuit electronic device of  claim 1 , wherein the first magnet and the second magnet are configured to bias the at least one fullerene molecule within the cavity. 
     
     
       3. The flexible circuit electronic device of  claim 1 , wherein at least one of the first sensor or the second sensor comprises a magnetic sensor. 
     
     
       4. The flexible circuit electronic device of  claim 3 , wherein the magnetic sensor comprises at least one of: a Hall Effect sensor and a Flux Gate sensor. 
     
     
       5. The flexible circuit electronic device of  claim 1 , wherein at least one of the first sensor or the second sensor comprises a copper coil. 
     
     
       6. The flexible circuit electronic device of  claim 5 , wherein the copper coil forms at least one small scale antenna. 
     
     
       7. The flexible circuit electronic device of  claim 1 , wherein the cavity is formed between the second flexible circuit layer and the third flexible circuit layer. 
     
     
       8. The flexible circuit electronic device of  claim 1 , wherein the at least one fullerene molecule comprises at least one single atom-doped fullerene molecule. 
     
     
       9. The flexible circuit electronic device of  claim 1 , wherein the at least one fullerene molecule comprises nitrogen-doped fullerene. 
     
     
       10. The flexible circuit electronic device of  claim 1 , wherein the flexible circuit electronic device comprises a solid-state miniature atomic clock. 
     
     
       11. A method of manufacturing an electronics device, comprising:
 etching a silicon substrate to form a cavity; 
 depositing one or more molecules into the cavity; 
 generating at least one through silicon via (TSV); 
 filling the at least one TSV with copper; 
 placing a first magnet on a first side of the silicon substrate; and 
 placing a second magnet on a second side of the silicon substrate. 
 
     
     
       12. The method of  claim 11 , wherein the first magnet and the second magnet are placed on opposite sides of the silicon substrate. 
     
     
       13. The method of  claim 11 , wherein the copper forms a many-turn copper coil. 
     
     
       14. The method of  claim 13 , wherein the many-turn copper coil is perpendicular to a top surface of the silicon substrate. 
     
     
       15. The method of  claim 11 , further comprising biasing the one or more molecules using the first magnet and the second magnet. 
     
     
       16. A global resource locator (“GRL”) device, comprising:
 a clock comprising:
 a first flexible circuit layer, comprising a first sensor; 
 a second flexible circuit layer attached to the first flexible circuit layer; 
 a third flexible circuit layer attached to the second flexible circuit layer, wherein the third flexible circuit layer comprises a second sensor; 
 at least one molecule within a cavity; 
 a first magnet attached to the first flexible circuit layer; and 
 a second magnet attached to the third flexible circuit layer; and 
 
 a processor coupled to the clock, the processor configured to receive timing information from the clock. 
 
     
     
       17. The GRL device of  claim 16 , wherein the processor is further configured to determine a location of the GRL device. 
     
     
       18. The GRL device of  claim 17 , wherein the processor is further configured to associate the location of the GRL device with the timing information. 
     
     
       19. The GRL device of  claim 16 , wherein the clock is in logical communication with a timing interface module to provide the timing information. 
     
     
       20. The GRL device of  claim 16 , wherein the at least one molecule comprises at least one single atom-doped fullerene molecule.