Method and system for heat dissipation in a current compensation circuit

Abstract

A method is provided for heat dissipation in a current compensation circuit (211, 221, 231) of a charger that charges a high-voltage battery. The charger is supplied with AC current from a charging cable on its input side and DC current for charging the high-voltage battery is provided by the charger on its output side. The charger does not have galvanic isolation and a leakage current is brought about by the AC current in at least one capacitor that is installed in the charger on the input side and connected to a protective conductor. The leakage current is compensated by the current compensation circuit (211, 221, 231) that is formed by power semiconductor electronics (211, 221, 231). Heat arising in the power semiconductor electronics (211, 221, 231) is dissipated by connecting the power semiconductor electronics to a carrier plate (212, 222, 232) within a housing of the charger (100).

What is claimed is: 
     
       1. A method for dissipating heat from a galvanically non-isolated charger, the charger having an input side, an output side, at least one capacitor installed in the charger on the input side and connected to a protective conductor, and a current compensation circuit formed by power semiconductor electronics for charging a high-voltage battery, the method comprising:
 supplying the input side of the charger with AC current from a charging cable; 
 supplying DC current from the output side for charging the high-voltage battery; 
 bringing about a leakage current by the AC current in the at least one capacitor in the charger; 
 compensating the respective leakage current by the power semiconductor electronics of the current compensation circuit; and 
 dissipating heat arising in the power semiconductor electronics to a carrier plate disposed in a housing of the charger of the charger and connected to the power semiconductor electronics. 
 
     
     
       2. The method of  claim 1 , wherein the power semiconductor electronics are connected to the carrier plate via a gap filler or a gap pad between the power semiconductor electronics and the carrier plate. 
     
     
       3. The method of  claim 1 , wherein the the power semiconductor electronics are attached to the carrier plate by a clamp that presses the power semiconductor electronics to the carrier plate. 
     
     
       4. The method of  claim 1 , wherein adhesive vanes are attached to the power semiconductor electronics and that are bonded adhesively to the carrier plate. 
     
     
       5. The method of  claim 1 , wherein the current compensation circuit is arranged directly on the carrier plate and the carrier plate is connected to a water cooling system, the method comprising directing cooling water through the cooling water system for dissipating the heat from the power semiconductor electronics. 
     
     
       6. The method of  claim 1 , wherein the carrier plate is an IMS circuit board or a DBC circuit board is selected as. 
     
     
       7. The method of  claim 1 , wherein the carrier plate forms a housing wall of the charger. 
     
     
       8. A system for heat dissipation in a current compensation circuit, the system comprising: a galvanically non-isolated charger having the current compensation circuit, the charger having: an input side that receives AC current from a charging cable, an output side that provides DC current for charging a high-voltage battery, at least one capacitor disposed at the input side of the charger and being connected to a protective conductor, the current compensation circuit being configured to compensate a leakage current brought about by the AC current in the at least one capacitor, and the current compensation circuit comprising power semiconductor electronics in which heat is developed due to the compensation of the leakage current, and a carrier plate to which the power semiconductor electronics are connected, the carrier plate being configured to absorb and dissipate the heat from the power electronics. 
     
     
       9. The system of  claim 8 , further comprising a gap filler or a gap pad between the power semiconductor electronics and the carrier plate. 
     
     
       10. The system of  claim 8 , wherein the current compensation circuit is arranged directly on the carrier plate, and the system further comprising a water cooling system that is connected to the carrier plate and that dissipates heat transferred from the current compensation circuit to the carrier plate. 
     
     
       11. The system of  claim 8 , further comprising a clamp that presses the power semiconductor electronics to the carrier plate. 
     
     
       12. The system of  claim 8 , further comprising adhesive vanes attached to the power semiconductor electronics and bonded adhesively to the carrier plate.