Printed circuit boards including a rigid region on which devices or connectors are to be mounted and a flexible region that is bendable, and methods of manufacturing same

Abstract

Disclosed are a printed circuit board manufactured by filling a via hole formed in a flexible board and a via hole formed in a cured base substrate and then laminating the flexible board and the cured base substrate and a method of manufacturing same. The method includes preparing a flexible board including a flexible region and a rigid region, preparing a cured base substrate, and laminating the cured base substrate on the rigid region of the flexible board, in which during the laminating, via holes respectively formed in the flexible board and the cured base substrate are first filled with a conductive material and then the flexible board and the cured base substrate are laminated.

The invention claimed is: 
     
       1. A method of manufacturing a printed circuit board, the method comprising:
 preparing a flexible board including a flexible region and a rigid region; 
 preparing a cured base substrate; and 
 laminating the cured base substrate on the rigid region of the flexible board, 
 wherein the preparing of the flexible board comprises: 
 preparing a flexible base substrate; 
 forming a first via hole in a flexible region of the flexible base substrate; 
 forming a plating layer by plating one surface of the flexible base substrate and an inside wall surface of the first via hole; 
 etching the plating layer to form an internal circuit pattern; and 
 forming a protective layer to cover the internal circuit pattern, 
 forming a second via hole within the rigid region of the flexible board; 
 filling the second via hole formed in the flexible board with a conductive material, 
 wherein the preparing the cured base substrate comprises: 
 forming a via hole communicating with the second via hole in the cured base substrate; 
 filling the via hole communicating with the second via hole formed in the cured base substrate with a conductive material; 
 wherein the laminating comprises: 
 laminating the cured base substrate where the via hole communicating with the second via hole is formed on the rigid region of the flexible board where the second via hole is formed; and 
 forming an external circuit pattern on one surface of the cured base substrate laminated on the flexible board. 
 
     
     
       2. The method according to  claim 1 , wherein the cured base substrate is a prepreg sheet that is formed by shaping an epoxy region in which glass fiber is contained in the form of a sheet. 
     
     
       3. The method according to  claim 1 , wherein in the laminating of the cured base substrate, the second via hole formed in the cured base substrate is disposed on the second via hole formed in the flexible board.