Process chamber for field guided exposure and method for implementing the process chamber
Abstract
A method and apparatus disclosed herein apply to processing a substrate, and more specifically to a method and apparatus for improving photolithography processes. The apparatus includes a chamber body, a substrate support disposed within the chamber body, and an electrode assembly. The substrate support has a top plate disposed above the substrate support, a bottom plate disposed below the substrate support, and a plurality of electrodes connecting the top plate to the bottom plate. A voltage is applied to the plurality of electrodes to generate an electric field. Methods for exposing a photoresist layer on a substrate to an electric field are also disclosed herein.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A processing chamber comprising:
a chamber body;
a substrate support disposed in the chamber body; and
an electrode assembly, the electrode assembly comprising:
a top plate disposed above the substrate support;
a bottom plate disposed below the substrate support; and
a plurality of electrodes connecting the top plate to the bottom plate, the electrodes operable, upon application of a voltage thereto, to generate an electric field, wherein the plurality of electrodes are displaced vertically to electrically connect and disconnect the top plate to the bottom plate and are configured to split and move vertically to electrically connect and disconnect the top plate to the bottom plate.
2. The processing chamber of claim 1 , wherein the electrode assembly is configured to couple to a power source.
3. The processing chamber of claim 1 , wherein the bottom plate further comprises an opening therethough, wherein a portion of the substrate support is disposed through the opening.
4. The processing chamber of claim 1 , wherein the plurality of electrodes is in a cylindrical arrangement and at least one electrode of the plurality of electrodes is operable to move through the bottom plate.
5. The processing chamber of claim 1 , wherein the plurality of electrodes are disposed inside the chamber body.
6. The processing chamber of claim 1 , wherein the substrate support is rotatable.
7. The processing chamber of claim 1 , further
configured to independently control voltage provided to each of the electrodes.
8. The processing chamber of claim 7 , further configured to independently control voltage provided to a first electrode of the plurality of electrodes based on an angular orientation of the first electrode.
9. A processing chamber comprising:
a chamber body;
a substrate support disposed in the chamber body; and
an electrode assembly disposed in a processing volume defined by the chamber body, the electrode assembly comprising:
a top plate disposed above the substrate support;
a bottom plate disposed below the substrate support; and
a plurality of electrodes connecting the top plate to the bottom plate, each electrode in the plurality of electrodes having a first end and a second end, the first end contacting the top plate and the second end contacting the bottom plate, the electrodes operable, upon application of a voltage thereto, to generate an electric field directly above and parallel to the substrate support, wherein the plurality of electrodes are displaced vertically to electrically connect and disconnect the top plate to the bottom plate and are configured to split and move vertically to electrically connect and disconnect the top plate to the bottom plate.
10. The processing chamber of claim 9 , wherein the electrode assembly is configured to couple to a power source.
11. The processing chamber of claim 9 , wherein the bottom plate further comprises an opening therethough, wherein a portion of the substrate support is disposed through the opening.
12. The processing chamber of claim 9 , wherein the plurality of electrodes is in a cylindrical arrangement and is movable between a position where the second end of a first electrode of the plurality of electrodes contacts the bottom plate and a position where the second end of the first electrode is spaced from the bottom plate.
13. The processing chamber of claim 9 , wherein the substrate support is rotatable.
14. The processing chamber of claim 9 , further
configured to independently control voltage provided to each of the electrodes.
15. The processing chamber of claim 14 , further configured to independently control voltage provided to a first electrode of the plurality of electrodes based on an angular orientation of the first electrode.
16. A processing chamber comprising:
a chamber body;
a substrate support disposed in the chamber body; and
an electrode assembly, the electrode assembly comprising:
a top plate disposed above the substrate support;
a bottom plate disposed below the substrate support; and
a plurality of electrodes connecting the top plate to the bottom plate, the electrodes operable, upon application of a voltage thereto, to generate an electric field, the plurality of electrodes comprising at least one stationary electrode and at least one opening electrode, wherein the at least one opening electrode of the plurality of electrodes is displaced vertically to electrically connect and disconnect the top plate to the bottom plate and are configured to split and move vertically to electrically connect and disconnect the top plate to the bottom plate.
17. The process chamber of claim 16 , wherein the bottom plate further comprises an opening therethough, wherein a portion of the substrate support is disposed through the opening.
18. The process chamber of claim 16 , wherein the at least one opening electrode comprises a top opening electrode configured to extend at least partially outside the processing chamber.
19. The process chamber of claim 18 , wherein the top opening electrode is coupled to an actuator.
20. The process chamber of claim 16 , wherein the at least one opening electrode comprises a bottom opening electrode configured to extend at least partially outside the processing chamber.Join the waitlist — get patent alerts
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