US10873991B2ActiveUtilityA1

Photonic near infrared heater

Assignee: PRASHER RAVI SHANKARPriority: Jan 27, 2017Filed: Jan 25, 2018Granted: Dec 22, 2020
Est. expiryJan 27, 2037(~10.5 yrs left)· nominal 20-yr term from priority
H05B 3/009
36
PatentIndex Score
0
Cited by
10
References
5
Claims

Abstract

A multilayer photonic stack comprising a lower plurality of alternating layers comprising at least A and B and an upper plurality of alternating layers comprising at least C and D, layer A comprises at least one of Al, Au, W, Ag, Ni, Ti, Pt, and Cr, layer B comprises at least one of Al2O3, AlN, MgO, SiO2, TiO2, Si3N4, MgF2, Ta2O5, SiC, Si, Ge, and Indium Tin Oxide (ITO), and layers C and D comprise at least one of Al2O3, AlN, MgO, SiO2, TiO2, Si3N4, MgF2, Ta2O5, SiC, Si, Ge, and Indium Tin Oxide (ITO).

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A multilayer photonic stack comprising:
 a lower portion of layers comprising a first layer of A and a first layer of B, 
 the first layer of A comprising at least one of Al, Au, W, Ag, Ni, Ti, Pt, and Cr, and 
 the first layer of B comprising at least one of Al 2 O 3 , AlN, MgO, SiO 2 , TiO 2 , Si 3 N 4 , MgF 2 , Ta 2 O 5 , SiC, Si, Ge, and indium tin oxide (ITO); and 
 an upper portion of layers disposed on the lower portion of layers, the upper portion of layers comprising a plurality of sets of a layer of C and a layer of D disposed on the layer of C, 
 the layer of C and the layer of D each comprising at least one of Al 2 O 3 , AlN, MgO, SiO 2 , TiO 2 , Si 3 N 4 , MgF 2 , Ta 2 O 5 , SiC, Si, Ge, and indium tin oxide (ITO), and the layer of C and the layer of D being different compositions; 
 the multilayer photonic stack having an emissivity in the near infrared (NIR) range with the emissivity being at a maximum at a wavelength between 0.7 microns and 3 microns, and the multilayer photonic stack being disposed on a filament coil of a radiative heater. 
 
     
     
       2. The multilayer photonic stack of  claim 1 , wherein the lower portion of layers comprises a second layer of A to form a structure comprising the first layer of B disposed between the first layer of A and the second layer of A. 
     
     
       3. The multilayer photonic stack of  claim 1 , wherein a thickness of the first layer of A is 5 nanometers to 1 micron, and wherein a thickness of the first layer of B is 5 nanometers to 1 micron. 
     
     
       4. The multilayer photonic stack of  claim 1 , wherein a thickness of the layer of C is 5 nanometers to 1 micron, and wherein a thickness of the layer of D is 5 nanometers to 1 micron. 
     
     
       5. The multilayer photonic stack of  claim 2 , wherein a thickness of the second layer of A is 5 nanometers to 1 micron.

Join the waitlist — get patent alerts

Track US10873991B2 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.