US10765014B2ActiveUtilityA1

Substrate unit and substrate assembly, and camera module using same

Assignee: LG INNOTEK CO LTDPriority: Jul 30, 2015Filed: May 7, 2019Granted: Sep 1, 2020
Est. expiryJul 30, 2035(~9 yrs left)· nominal 20-yr term from priority
Inventors:Hyun Woo Ryou
H04N 23/55H04N 23/57H04N 23/54H05K 2201/2009H05K 1/147H05K 1/145H05K 1/0281H05K 1/148H05K 3/4691H05K 3/365H05K 1/144H05K 1/14H05K 1/02H05K 2201/056H05K 2201/09163H05K 2201/10121H05K 2201/09145H05K 2201/09063H04N 5/2257H04N 5/2254H04N 5/2253H04N 23/50
83
PatentIndex Score
2
Cited by
16
References
23
Claims

Abstract

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A substrate unit, comprising:
 a first printed circuit board; and 
 a flexible printed circuit board coupled to the first printed circuit board, 
 wherein the first printed circuit board comprises a first lateral surface, a second lateral surface, and a recess formed on the first lateral surface of the first printed circuit board, 
 wherein a first imaginary tangent line meets the first lateral surface of the first printed circuit board, 
 wherein a second imaginary tangent line parallel to the first imaginary tangent line meets a bottom surface of the recess of the first printed circuit board, 
 wherein a third imaginary tangent line is disposed between the first imaginary tangent line and the second imaginary tangent line, and meets the second lateral surface of the first printed circuit board, and 
 wherein the second lateral surface of the first printed circuit board is overlapped with the flexible printed circuit board. 
 
     
     
       2. The substrate unit of  claim 1 , wherein the first printed circuit board is a rigid printed circuit board. 
     
     
       3. The substrate unit of  claim 1 , wherein the first printed circuit board comprises a protrusion including the second lateral surface and protruding from the bottom surface of the recess of the first printed circuit board, and
 wherein the flexible printed circuit board extends from the protrusion of the first printed circuit board. 
 
     
     
       4. The substrate unit of  claim 1 , wherein the second lateral surface is disposed at a position further inward than is a position of the first lateral surface, and
 wherein the second lateral surface of the printed circuit board is disposed such that it protrudes more than the bottom surface of the recess does. 
 
     
     
       5. The substrate unit of  claim 1 , wherein the recess comprises a first lateral part connected to the first lateral surface of the first printed circuit board and facing the flexible printed circuit board,
 wherein the recess comprises a first rib connecting the first lateral part of the recess and the bottom surface of the recess, and 
 wherein the first rib of the recess is formed in a round shape. 
 
     
     
       6. The substrate unit of  claim 5 , wherein the recess comprises a second lateral part facing the first lateral part of the recess, and a second rib connecting the bottom surface of the recess and the second lateral part of the recess, and
 wherein the second rib of the recess is formed in a round shape. 
 
     
     
       7. The substrate unit of  claim 6 , wherein a curvature of the first rib is different from a curvature of the second rib. 
     
     
       8. The substrate unit of  claim 1 , wherein the flexible printed circuit board has a first width, measured in a first direction, at a position where the first printed circuit board and the flexible printed circuit board meet,
 wherein the recess of the first printed circuit board has a second width measured in the first direction, and 
 wherein the second width of the recess is greater than the first width of the flexible printed circuit board. 
 
     
     
       9. The substrate unit of  claim 1 , wherein the recess comprises at least one surface spaced apart from the flexible printed circuit board. 
     
     
       10. The substrate unit of  claim 1 , wherein at least one portion of the recess of the first printed circuit board is formed with a radius of curvature of 0.3 mm-0.5 mm. 
     
     
       11. The substrate unit of  claim 1 , wherein the recess comprises a first surface connected to the first lateral surface of the first printed circuit board, and facing the flexible printed circuit board, and
 wherein a distance between the first surface of the recess and the flexible printed circuit board is 0.5 mm-2.0 mm. 
 
     
     
       12. The substrate unit of  claim 1 , wherein a distance between the first lateral surface of the first printed circuit board and the bottom surface of the recess is less than 2.0 mm. 
     
     
       13. The substrate unit of  claim 1 , wherein the recess comprises a curved surface spaced apart from the flexible printed circuit board,
 wherein the curved surface of the recess of the first printed circuit board has a curvature, and 
 wherein a radius of the curvature of the curved surface is 0.3 mm-0.5 mm. 
 
     
     
       14. The substrate unit of  claim 1 , wherein the recess is opened in a direction perpendicular to the third imaginary line. 
     
     
       15. The substrate unit of  claim 1 , wherein the first lateral surface comprises a first end connected to the recess and a second end opposite to the first end, and
 wherein the second end has a curvature. 
 
     
     
       16. The substrate unit of  claim 1 , wherein edge portions of the first printed circuit board comprise avoidance parts recessed inwardly. 
     
     
       17. A camera module comprising:
 the substrate unit of  claim 1 ; 
 a lens part; and 
 an image sensor disposed on the first printed circuit board of the substrate unit. 
 
     
     
       18. A substrate unit, comprising:
 the substrate unit of  claim 2 ; and 
 a second printed circuit board, 
 wherein the flexible printed circuit board connects the first circuit board and the second printed circuit board, 
 wherein the second printed circuit board comprises a fourth lateral surface, a fifth lateral surface, and a further recess formed on the fourth lateral surface of the second printed circuit board, 
 wherein the second printed circuit board is a rigid printed circuit board, 
 wherein a fourth imaginary tangent line meets the fourth lateral surface of the second printed circuit board, 
 wherein a fifth imaginary tangent line parallel to the fourth imaginary tangent line meets a bottom surface of the further recess of the second printed circuit board, 
 wherein a sixth imaginary tangent line is disposed between the fourth imaginary tangent line and the fifth imaginary tangent line, and meets the fifth lateral surface of the second printed circuit board, and 
 wherein the fifth lateral surface of the second printed circuit board is overlapped with the flexible printed circuit board. 
 
     
     
       19. A substrate unit, comprising:
 a first printed circuit board; and 
 a flexible printed circuit board coupled to the first printed circuit board, 
 wherein the first printed circuit board comprises a first lateral surface, a second lateral surface disposed further inward than is the first lateral surface, and a third lateral surface disposed further outward than is the second lateral surface, 
 wherein the first lateral surface is an outermost lateral surface of the first printed circuit board, and 
 wherein the third lateral surface is overlapped with the flexible printed circuit board. 
 
     
     
       20. The substrate unit of  claim 19 , wherein the first printed circuit board comprises a first lateral part disposed between the first lateral surface and the second lateral surface,
 wherein the first printed circuit board comprises a first rib connecting the first lateral part and the second lateral surface, and 
 wherein the first rib is formed in a round shape. 
 
     
     
       21. The substrate unit of  claim 20 , wherein the first printed circuit board comprises a second lateral part disposed between the second lateral surface and the third lateral surface,
 wherein the printed circuit board comprises a second rib connecting the second lateral part and the second lateral surface, and 
 wherein the second rib is formed in a round shape. 
 
     
     
       22. The substrate unit of  claim 19 , wherein the first printed circuit board comprises a first recess and a second recess formed on the first recess,
 wherein the third lateral surface is a bottom surface of the first recess, and 
 wherein the second lateral surface is a bottom surface of the second recess. 
 
     
     
       23. A substrate unit, comprising:
 a first printed circuit board; and 
 a flexible printed circuit board coupled to the first printed circuit board, 
 wherein the first printed circuit board comprises a first lateral surface and a recess formed on the first lateral surface, 
 wherein the recess of the first printed circuit board comprises a first bottom surface formed a first depth from the first lateral surface of the first printed circuit board, and a second bottom surface formed at a second depth, 
 wherein the second depth is greater than the first depth, and 
 wherein the flexible printed circuit board is overlapped with the first bottom surface of the recess of the first printed circuit board.

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