Method of manufacturing semiconductor devices and corresponding semiconductor device

Abstract

A method of attaching a semiconductor die or chip onto a support member such as a leadframe comprises: applying onto the support member at least one stretch of ribbon electrical bonding material and coupling the ribbon material to the support member, arranging at least one semiconductor die onto the ribbon material with the ribbon material between the support member and the semiconductor die, coupling the semiconductor die to the ribbon material.

The invention claimed is: 
     
       1. A method, comprising:
 applying onto a surface of a semiconductor die support member a conductive ribbon and coupling the conductive ribbon to the support member, 
 arranging a semiconductor die onto the conductive ribbon with the conductive ribbon between the support member and the semiconductor die, and 
 affixing the semiconductor die to the conductive ribbon, wherein:
 the coupling the conductive ribbon to the support member comprises attaching the conductive ribbon to the support member at a plurality of attachment points with one or more bridge-like sections extending between the attachment points without contacting the surface of the support member; and 
 the affixing the semiconductor die to the conductive ribbon comprises applying attachment energy to the semiconductor die and the support member with the one or more bridge-like sections of the conductive ribbon arranged therebetween. 
 
 
     
     
       2. The method of  claim 1 , wherein the conductive ribbon comprises a lead-free material. 
     
     
       3. The method of  claim 1 , wherein the conductive ribbon comprises silver and/or aluminum. 
     
     
       4. The method of  claim 1 , wherein applying attachment energy comprises applying the attachment energy selected out of heat, pressure and ultrasound. 
     
     
       5. The method of  claim 1 , wherein attaching the conductive ribbon to the support member at the plurality of attachment points includes attaching the conductive ribbon to the support member at three or more attachment points with a plurality of bridge-like sections extending between the attachment points. 
     
     
       6. The method of  claim 5 , comprising forming wedge imprints at the plurality of attachment points using a wedging tool. 
     
     
       7. The method of  claim 1 , comprising applying onto the support member a plurality of conductive ribbons extending lengthwise along a length of the semiconductor die and arranged side-by-side across a width of the semiconductor die. 
     
     
       8. The method of  claim 1 , wherein attaching the first ribbon to the support member comprises attaching the first ribbon to the support member at a plurality of attachment points. 
     
     
       9. A semiconductor device, comprising:
 a semiconductor die support member, 
 a plurality of ribbons of electrical bonding material, including a first ribbon of electrical bonding material positioned on and coupled to the support member, the ribbons extending lengthwise along a length of the semiconductor die and being spaced apart from each other and arranged across a width of the semiconductor die; and 
 a semiconductor die arranged onto the first ribbon with the first ribbon between the support member and the semiconductor die, with the semiconductor die fixed to the electrical bonding material of the first ribbon. 
 
     
     
       10. The semiconductor device of  claim 9 , wherein the first ribbon comprises lead-free material. 
     
     
       11. The semiconductor device of  claim 9 , wherein the first ribbon comprises silver and/or aluminum. 
     
     
       12. A method, comprising:
 attaching a first ribbon of electrical bonding material to a conductive support member at a plurality of attachment points with one or more bridge-like sections extending between the attachment points without contacting the surface of the support member; 
 arranging a semiconductor die onto the first ribbon, with the one or more bridge-like sections of the first ribbon being between the support member and the semiconductor die; 
 and 
 affixing the semiconductor die to the first ribbon, the affixing including affixing applying attachment energy to at least one of the semiconductor die and first ribbon. 
 
     
     
       13. The method of  claim 12 , wherein the first ribbon comprises silver and/or aluminum. 
     
     
       14. The method of  claim 12 , wherein applying attachment energy includes applying at least one of heat, pressure and ultrasound. 
     
     
       15. The method of  claim 12 , comprising:
 affixing a plurality of conductive ribbons, including the first ribbon, to the support member, wherein arranging the semiconductor die includes arranging the semiconductor die such that the plurality of conductive ribbons are spaced apart from each other and arranged across a width of the semiconductor die. 
 
     
     
       16. The method of  claim 12 , wherein attaching the conductive ribbon to the support member at the plurality of attachment points includes attaching the conductive ribbon to the support member at three or more attachment points with a plurality of bridge-like sections extending between the attachment points. 
     
     
       17. The method of  claim 12 , comprising forming wedge imprints at the plurality of attachment points using a wedging tool.