Energy conversion apparatus and method of manufacture

Abstract

A new class of thermoelectric and energy conversion apparatus, that enhances the efficiency of converting one form of energy to another using a wide range of energy conversion materials. The new method of stimulating greater electrical conversion using polymers and thermoelectric composite materials that have unique properties similar to commercial superconductors. The invention entails processes that create and interconnect the superconducting polymer layers through an assembly lowering internal resistance, impeding phonon conduction and stimulating increase in electron flow through the device with increased electrical power. The invention includes the use of dopants that are mixed with a polymer solution to build superconducting polymer connections between the thermoelectric device layers.

I claim: 
     
       1. A device for converting a heat to an electrical energy, comprising:
 a heat source; 
 a heat sink; 
 an electrical load; 
 a solder-less thermoelectric assembly formed from a stack of layers, comprising:
 one or more copper layers for conducting the heat from the heat source to the stack and the electrical energy from the stack to the load; 
 one or more P-Type semiconductor layers for converting the heat to the electrical energy; 
 one or more copper layers for conducting the heat from the stack to the heat sink and the electrical energy from the stack to the load; 
 one or more N-Type semiconductor layers for converting the heat to the electrical energy; and 
 a coating of superconducting polymer covering each of the copper layers, the one or more P-Type semiconductor layers, and the one or more N-Type semiconductor layers, wherein the coating is carbonized after assembly of the stack of layers; 
 
 a switching mechanism connecting one or more electrical paths from the stack to the electrical load; and 
 pressure applying member for maintaining the plurality of adjoining layers in an intimate contact. 
 
     
     
       2. The device of  claim 1 , wherein a second electrical path from the stack to the electrical load is established before a first electrical path from the stack to the electrical load is severed. 
     
     
       3. The device of  claim 2 , wherein a quiescent period separates a severing of the first electrical path from the stack to the electrical load and a establishment of the second electrical path to the electrical load. 
     
     
       4. The device of  claim 1 , wherein one or more of the copper layers or the P-Type semiconductor layers or the N-Type semiconductor layers are formed by a sintering process or a casting process. 
     
     
       5. The device of  claim 4 , wherein one or more surfaces of one or more of the P-Type semiconductor layers or the N-Type semiconductor layers has an as-cast surface. 
     
     
       6. The device of  claim 1 , wherein all or part of one or more of the layers in the stack is coated with a metal ion diffusion barrier. 
     
     
       7. The device of  claim 1 , wherein the coating of superconducting polymer carries the electrical energy between the adjoining layers with one or more superconducting polymer threads for an interconnection while impeding a flow of phonons through the superconducting polymer threads to the adjoining layers. 
     
     
       8. The device of  claim 7 , wherein the coating of the superconducting polymers is of a sufficient thickness for bridging a gap between one or more irregularities in the adjoining layers. 
     
     
       9. The device of  claim 7 , wherein the coating of superconducting polymers is resilient for maintaining a flow of the electrical energy between the adjoining layers during a change in a dimension due to different thermal properties and a temperature gradients causing a expansion and a contraction. 
     
     
       10. The device of  claim 7 , wherein the coating of superconducting polymer prevents an oxidation of the layer during and after formation. 
     
     
       11. The device of  claim 7 , wherein one or more of the layers in the stack contains a high temperature material for aiding a formation of a superconducting polymer threads in a layered coating. 
     
     
       12. The device of  claim 11 , wherein the superconducting polymer is a high temperature superconducting polymer derivative. 
     
     
       13. The device of  claim 1 , wherein one or more of the layers in the stack contains a carbonized hydrocarbon superconducting polymer derivative. 
     
     
       14. The device of  claim 1 , wherein all or part of one or more layers in the stack are coated with a superconducting material that confirms to a space between the layers that are adjoining. 
     
     
       15. The device of  claim 14 , wherein the superconducting material is a superconducting polymer paste. 
     
     
       16. The device of  claim 15 , wherein the superconducting polymer paste contains a metal and a binder. 
     
     
       17. The device of  claim 16 , wherein the metal is bismuth or copper and the binder includes propylene and a dopant. 
     
     
       18. The device of  claim 1 , wherein the pressure applying member is a cryogenically conditioned metallic member. 
     
     
       19. The device of  claim 1 , wherein the pressure applying member is a spring. 
     
     
       20. The device of  claim 19 , wherein the spring contains a nickel or chromium or iron alloy. 
     
     
       21. The device of  claim 1 , wherein one or more of a Peltier, a magneto-caloric or an electro-caloric or a superconducting polymer effect reduces a temperature of one or more of the copper layers for producing a greater flow of the electrical energy than can be explained by a temperature difference between the heat source and the heat sink. 
     
     
       22. A device for converting a heat to an electrical energy, comprising:
 a heat source; 
 a heat sink; 
 an electrical load; 
 a solder-less thermoelectric assembly formed from a stack of layers comprising:
 one or more first copper layers for conducting the heat from the heat source to the stack and the electrical energy from the stack to the load; 
 one or more P-Type semiconductors for converting the heat to the electrical energy; 
 or more second copper layers for conducting the heat from the stack to the heat sink and the electrical energy from the stack to the electrical load; and 
 one or more N-Type semiconductors for converting the heat to the electrical energy; 
 
 a switching mechanism connecting one or more electrical paths from the stack to the electrical load; and 
 a pressure applying member for maintaining the layers in a intimate contact; 
 wherein a second electrical path to the electrical load is established before a first electrical path is severed; 
 wherein one or more of the copper layers or the P-Type semiconductor layers or the N-Type semiconductor layers are formed by a sintering process or a casting process; 
 wherein a surface of one or more of the copper layers or the P-Type semiconductor layers or the N-Type semiconductor layers remain in an as cast; 
 wherein a coating of superconducting polymer covers each of the first and second copper layers, the one or more P-Type semiconductor layer and the one or more N-Type semiconductor layers, wherein the coating is carbonized after assembly of the stack of layers, the coating being disposed between at least two components of the stack of layers, the coating carrying the electrical energy between the layers with the superconducting polymer threads interconnected while impeding a flow of phonons through the superconducting polymer threads to the layers; 
 wherein the coating of superconducting polymers is of a sufficient thickness for bridging a gap between an irregularity between the layers; 
 wherein the coating of superconducting polymers is resilient for maintaining an electron flow between the layers during changes in a dimension due to a thermal properties of a expansion and a contraction.