Cooling device with small structured rib-dimple hybrid structures
Abstract
A cooling device with small structured rib-dimple hybrid structures, comprising a substrate, a cooling channel, a plurality of small structured ribs and a plurality of dimples. The cooling channel, the plurality of small structured ribs and the plurality of dimples are all disposed on the wall surface of the substrate; the plurality of dimples are in a staggered arrangement or in a longitudinal arrangement, forming a dimple array; an upstream wall surface of each dimple or a plurality of dimples is provided with the small structured ribs, thus forming an small structured rib-dimple hybrid structure.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1. A cooling device with structured rib-dimple hybrid structures, comprising a substrate, a cooling channel, a plurality of structured rib-dimple hybrid structures, wherein
the cooling channel is disposed on a wall surface of the substrate;
the structured rib-dimple hybrid structures are also disposed on the wall surface, forming an array of structured rib-dimple hybrid structures, the structured rib-dimple hybrid structures being in a staggered arrangement or in a longitudinal arrangement on the wall surface;
each of the structured rib-dimple hybrid structures is an integrated structure, which comprises one dimple with one structured rib at an upstream wall surface;
wherein the structured rib is composed of two ribs forming a V-shape rib with a closed apex, each structured rib is positioned upstream each dimple with the closed apex of the V-shape rib pointing toward the coming fluid flow and the opening of the V-shape rib pointing toward the downstream dimple;
the width of the structured rib is not larger than 2.0 mm, and the height thereof is not larger than 2.0 mm.
2. The cooling device with structured rib-dimple hybrid structures according to claim 1 , wherein each structured rib-dimple hybrid structure is formed on the wall surface of the substrate through investment casting, milling or soldering.
3. The cooling device with structured rib-dimple hybrid structures according to claim 1 , wherein each dimple is shaped as part of a sphere, an ellipsoid or a teardrop.
4. The cooling device with structured rib-dimple hybrid structures according to claim 1 , wherein each dimple is formed on the wall surface of the substrate through investment casting, milling or stamping.
5. The cooling device with structured rib-dimple hybrid structures according to claim 1 , wherein the depth of each dimple is 0.05 to 0.3 times the diameter of the dimple.
6. The cooling device with structured rib-dimple hybrid structures according to claim 1 , wherein a cross-section of either of the two ribs has a rectangular shape, a filleted rectangular shape, a trapezoidal shape, or a triangular shape.Join the waitlist — get patent alerts
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