First socket nested in a second socket

Abstract

Examples herein disclose an apparatus. The apparatus includes a first socket nested in a second socket. The first socket includes a cavity, disposed in the first socket, to accept a chipset. The first socket includes an electrical contact, disposed in the cavity, to couple the chipset to a board. The chipset detects when a modular infrastructure is coupled to the second socket.

We claim: 
     
       1. An apparatus comprising:
 a first socket nested within a second socket, the first socket comprising:
 a cavity, disposed in the first socket, to accept a chipset; and 
 an electrical contact, disposed in the cavity, to couple the chipset to a board,
 wherein the chipset, based on data from connectors of the second socket, detects when a modular infrastructure is coupled to the connectors of the second socket and a type of modular infrastructure coupled to the second socket; 
 wherein the chipset sends the type of modular infrastructure to a controller. 
 
 
 
     
     
       2. The apparatus of  claim 1  comprising:
 an antenna, coupled to the cavity of the first socket, to detect when the modular infrastructure is coupled to the second socket. 
 
     
     
       3. The apparatus of  claim 1  comprising:
 an antenna, coupled to the chipset, to detect when the modular infrastructure is coupled to the second socket. 
 
     
     
       4. The apparatus of  claim 1  comprising:
 the second socket comprising a different cavity to accept the first socket, wherein the different cavity is elevated above the cavity. 
 
     
     
       5. The apparatus of  claim 1  wherein the chipset includes a near-field communication (NFC) reader and the modular infrastructure is associated with a near-field communication (NFC) tag. 
     
     
       6. A system comprising:
 a multi-chip module comprising:
 radio-frequency identification (RFID) tags; and 
 a board comprising:
 a first socket, nested within a second socket, to accept a RFID device, wherein the RFID device detects when the multi-chip module is coupled to the second socket based on a reading of one of the RFID tags and wherein the RFID device detects characteristics of the multi-chip module based on other RFID tags attached to connectors of the second socket. 
 
 
 
     
     
       7. The system of  claim 6  wherein the multi-chip module comprises:
 an optical transceiver, coupled to the RFID tag, to couple to an optical connector disposed within the second socket. 
 
     
     
       8. The system of  claim 6  wherein the board comprises:
 an optical connector, coupled to the second socket, to couple an optical transceiver disposed on the multi-chip module, wherein each optical connector includes an additional RFID tag; and 
 the second socket, disposed on the board, to support the first socket. 
 
     
     
       9. The system of  claim 6  wherein the board comprises:
 an antenna coupled to the first socket. 
 
     
     
       10. The system of  claim 6  wherein the board comprises:
 an antenna coupled to the RFID device. 
 
     
     
       11. The system of  claim 6  wherein the board comprises:
 the RFID device, disposed in the first socket, upon detection of when the multi-chip module is coupled to the second socket to communicate the coupling to a controller for verification of the coupling. 
 
     
     
       12. A method comprising:
 installing a chipset in a first socket nested within a second socket; and 
 coupling an optical transceiver disposed on a multi-chip module to an optical connector supported by the second socket, wherein the chipset detects, based on data from the optical connector, when the optical transceiver is coupled to the optical connector and a type of optical transceiver coupled to the optical connector. 
 
     
     
       13. The method of  claim 12  comprising:
 embedding the first socket within the second socket to provide the first socket nested within the second socket. 
 
     
     
       14. The method of  claim 12  comprising:
 depositing an electrical contact in a cavity disposed in the first socket, wherein the cavity disposed in the first socket is lower in elevation than a cavity of the second socket.