Highly conductive transparent laminated glass article

Abstract

A highly conductive transparent laminated glass article includes two glass plates and an adhesive film. The adhesive film has a material of Poly(Vinyl Butyral) (PVB) resin and is located between the two glass plates. At least one of the two glass plates is a highly conductive transparent glass-based circuit board with a glass substrate. A surface of the glass substrate is not contact with the adhesive film. A conductive paste, printed on the surface of the glass substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate. The surface of the glass substrate and an upper surface of the conductive circuit are at the same level. The highly conductive transparent laminated glass article has the characteristics of high conductivity and high light transmittance. The highly conductive transparent laminated glass article is suitable for fabrication, manufacture, and use of industrial and smart-home devices.

What is claimed is: 
     
       1. A highly conductive transparent laminated glass article, comprising:
 two glass plates, at least one of the two glass plates being a highly conductive transparent glass-based circuit board with a glass substrate; and 
 an adhesive film, having a material of Poly(Vinyl Butyral) (PVB) resin and located between the two glass plates, 
 wherein a surface of the glass substrate is not contact with the adhesive film, and a conductive paste, printed on the surface of the glass substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate; 
 wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion; 
 wherein the glass substrate is a glass-tempered substrate, and a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer; 
 wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75:3:5 to 10:10 to 20:1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder; 
 wherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste; and 
 wherein a surface of the glass-tempered substrate faces air, and the conductive paste, printed on the surface of the glass-tempered substrate, is baked at a temperature between 120 and 150° C. for 100 to 200 seconds, placed at a temperature between 550 and 600° C. for 300 to 360 seconds, then placed at a temperature between 710 and 730° C. for 120 to 220 seconds, and finally cooled to form the conductive circuit fused with the surface of the glass-tempered substrate. 
 
     
     
       2. The highly conductive transparent laminated glass article of  claim 1 , wherein the surface of the glass substrate and an upper surface of the conductive circuit are at the same level. 
     
     
       3. The highly conductive transparent laminated glass article of  claim 1 , wherein the thickness of each of the two glass plates is 5 mm to 8 mm. 
     
     
       4. The highly conductive transparent laminated glass article of  claim 3 , wherein the thickness of each of the two glass plates is 6 mm, and the thickness of the adhesive film is 1.14 mm. 
     
     
       5. The highly conductive transparent laminated glass article of  claim 1 , wherein the thickness of the adhesive film is 1 mm to 2 mm.