Linear LED module

Abstract

Various aspects of a light emitting apparatus include a substrate having at least one angled portion. Some aspects of the light emitting apparatus include at least one light emitting device arranged on the substrate. Some aspects of the light emitting apparatus include a plurality of conductors arranged on the substrate. In some aspects of the light emitting apparatus, the conductors are electrically coupled to the at least one light emitting device.

What is claimed is: 
     
       1. A light emitting apparatus comprising:
 a substrate having at least one angled portion; 
 at least one light emitting device disposed on the substrate; and 
 a diffusive surface comprising a white portion disposed on the substrate around at least a portion of the at least one light emitting device. 
 
     
     
       2. The light emitting apparatus of  claim 1 , wherein the substrate further comprises a member supporting the at least one light emitting device, and wherein the angled portion is coupled to the member at an obtuse angle between the member and the angled portion. 
     
     
       3. The light emitting apparatus of  claim 1 , wherein the white portion comprises a white solder mask arranged around the at least one light emitting device. 
     
     
       4. The light emitting apparatus of  claim 2 , wherein the angled portion comprises a reflective surface, wherein the at least one angled portion has greater reflectivity than the member. 
     
     
       5. The light emitting apparatus of  2 , wherein an angle between the member and the at least one angled portion is selected to fit a troffer light fixture. 
     
     
       6. The light emitting apparatus of  claim 1 , wherein the at least one light emitting device comprises a flip chip LED. 
     
     
       7. The light emitting apparatus of  claim 6 , further comprising an encapsulant that encapsulates the flip chip LED. 
     
     
       8. The light emitting apparatus of  claim 1 , wherein the substrate comprises aluminum. 
     
     
       9. The light emitting apparatus of  claim 1 , where the light emitting device comprises a chip-on-board package. 
     
     
       10. A light emitting apparatus comprising:
 at least one light emitting device; 
 a flexible substrate comprising:
 a member supporting the at least one light emitting device; and 
 an angled portion extending from the member, wherein the angled portion comprises exposed aluminum. 
 
 
     
     
       11. The light emitting apparatus of  claim 10 , wherein the member comprises a diffusive surface arranged around at least a portion of the at least one light emitting device. 
     
     
       12. The light emitting apparatus of  claim 11 , wherein the diffusive surface comprises a white solder mask. 
     
     
       13. The light emitting apparatus of  claim 12 , wherein the angled portion comprises a reflective surface, and wherein the angled portion has greater reflectivity than the member. 
     
     
       14. The light emitting apparatus of  claim 10 , wherein an angle between the member and the angled portion is selected to fit a troffer light fixture. 
     
     
       15. The light emitting apparatus of  claim 10 , wherein the at least one light emitting device is a flip chip LED. 
     
     
       16. The light emitting apparatus of  claim 15 , further comprising an encapsulant that encapsulates the flip chip LED. 
     
     
       17. The light emitting apparatus of  claim 10 , where the at least one light emitting device comprises a chip-on-board package. 
     
     
       18. A troffer device comprising:
 a housing; 
 a substrate coupled to the housing and having at least one angled portion; 
 a light emitting device arranged on the substrate; and 
 a diffusive surface comprising a white portion disposed around at least a portion of the light emitting device. 
 
     
     
       19. The troffer device of  claim 18 , wherein the substrate comprises a plurality of layers having at least one dielectric disposed therebetween, and wherein the plurality of layers comprise at least one of aluminum and copper. 
     
     
       20. The troffer device of  claim 18 , further comprising an encapsulant disposed on a surface of the at least one light emitting device. 
     
     
       21. The troffer device of  claim 18 , wherein an angle of the at least one angled portion is in a range of 30-60 degrees. 
     
     
       22. The troffer of  claim 21 , wherein the substrate is a flexible substrate, and wherein the angle is of the angled portion is based on a shape of the housing. 
     
     
       23. The troffer device of  claim 18 , further comprising a diffusive lens positioned at a bottom of the housing. 
     
     
       24. The troffer of  claim 18 , wherein the angled portion comprises a reflective surface, and wherein diffusive and reflective surfaces are collectively configured to focus light in a downward direction.